Thermal protrusion reduction in magnet heads by utilizing a heat-spreading pad
AssigneeHeadway Technologies, Inc.
InventorsDevendra Chhabra, Rod Lee, Glen Garfunkel, Moris Dovek, Cherng-Chyi Han
Life of this patent
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Abstract
A magnetic read/write head and slider assembly and method for forming said magnetic read/write head and slider assembly, wherein said assembly has improved heat spreading and dissipation properties and exhibits significantly reduced thermal protrusion during operation. The method of formation is simple and efficient, involving only the extension of one of the conductive mounting pads so that it is in thermal contact with a portion of the slider assembly surface that is over the read/write element.
Claims11
1-10. (canceled)
A magnetic read/write head and slider assembly having improved heat spreading and heat dissipation characteristics and reduced thermal protrusion comprising:
- a magnetic read/write head and slider assembly on whose trailing end surface are formed a plurality of electrically isolated conducting pads, said pads providing electrical connections between said read/write head and external circuitry by means of internal current leads connected between said pads and said read/write head;
- and
- at least one of said conducting pads having a larger surface area, the surface area of said larger pads covering at least that portion of the trailing end surface that is above said read/write head and said pads being in thermal contact with said trailing end surface.
Dependencies are inferred from the claim text.