Semiconductor device and method for manufacturing the same

An electric device comprising:

• a control element;
• a driving element controlled by the control element;
• and
• a lead frame including an island part, a first lead terminal and a second lead terminal, wherein
• the control element and the driving element are disposed on a mounting surface of the island part,
• the control element is connected to the first lead terminal through a bonding wire,
• the driving element is connected to the second lead terminal through another bonding wire,
• the control element, the driving element, the bonding wires, the island part, and the first and the second lead terminals are molded with a resin mold,
• the first lead terminal extends in a first direction parallel to the mounting surface of the island part,
• the second lead terminal extends in a second direction parallel to the mounting surface of the island part,
• the first lead terminal has a top end, which is protruded from the resin mold, and
• the second lead terminal has a top end, which is protruded from the resin mold.

An electric device comprising:

• a plurality of terminals connecting to bonding wires, wherein
• the bonding wires include a gold wire made of gold and an aluminum wire made of aluminum,
• the aluminum wire has a diameter, which is larger than that of the gold wire,
• the terminals include a first terminal and a second terminal,
• the first terminal connects to the gold wire, and the second terminal connects to the aluminum wire,
• the first terminal includes a nickel layer coated on a surface of the first terminal,
• the first terminal further includes a silver layer coated on the nickel layer and disposed on a contact portion between the first terminal and the gold wire, and
• the second terminal includes a nickel layer coated on a surface of the second terminal.

An electric device comprising:

• a first circuit;
• a second circuit;
• and
• a plurality of terminals connecting to the first and the second circuits through bonding wires, respectively, wherein
• the second circuit is capable of flowing electric current therethrough,
• the second circuit has a capacity of the current, which is larger than that of the first circuit,
• the terminals include a first terminal and a second terminal,
• the bonding wires include a gold wire made of gold and an aluminum wire made of aluminum,
• the aluminum wire has a diameter, which is larger than that of the gold wire,
• the first terminal connects to the first circuit through the gold wire, and the second terminal connects to the second circuit through the aluminum wire,
• the first terminal includes a nickel layer coated on a surface of the first terminal,
• the first terminal further includes a silver layer coated on the nickel layer and disposed on a contact portion between the first terminal and the gold wire, and
• the second terminal includes a nickel layer coated on a surface of the second terminal.

An electric device comprising:

• a heat sink;
• an electric device disposed on the heat sink;
• a lead frame disposed around the electric device;
• and
• a resin mold molding the heat sink, the electric device, and the lead frame in such a manner that a bottom of the heat sink is exposed from the resin mold, wherein
• the lead frame includes a suspending lead connecting to the heat sink,
• the resin mold includes an upper portion and a lower portion,
• the upper portion of the resin mold is disposed above the suspending lead,
• the lower portion of the resin mold is disposed below the suspending lead, and
• the lower portion is protruded from the upper portion.

A method for manufacturing an electric device comprising the steps of:

• mounting an electric element on an upper surface of a heat sink;
• mounting a lead frame around the electric element;
• connecting the heat sink to a suspending lead of the lead frame;
• and
• molding the heat sink, the electric element, and the lead frame with a resin mold by using a mold in such a manner that a bottom of the heat sink is exposed from the resin mold, wherein
• the step of molding with the resin mold includes the steps of:
• pressing the suspending lead with a top mold of the mold;
• pressing the bottom of the heat sink on a bottom mold of the mold;
• and
• pouring melted resin into a cavity of the mold.