Forming a retrograde well in a transistor to enhance performance of the transistor
AssigneeTexas Instruments Incorporated
InventorsSrinivasan Chakravarthi, Pr Chrdambaram, Robert Bowen, Haowen Bu
Life of this patent
Estimating the term…
Loading patent…
AssigneeTexas Instruments Incorporated
InventorsSrinivasan Chakravarthi, Pr Chrdambaram, Robert Bowen, Haowen Bu
Estimating the term…
A method of forming a retrograde well in a transistor is provided. A transistor structure having a substrate, a gate, and a gate oxide layer between the substrate and the gate is formed. The substrate includes a channel region located generally below the gate. A first dopant is implanted into the channel region. A second dopant is implanted into the substrate to form a doped source region and a doped drain region. A third dopant is implanted into the gate oxide layer. A source/drain anneal is performed to form a source and a drain in the doped source region and the doped drain region, respectively. The source/drain anneal causes a portion of the first dopant in the channel region to be attracted by the third dopant into the gate oxide layer.
1-12. (canceled)
An integrated circuit comprising a plurality of transistors, a particular one of the transistors including a substrate, a gate, and a gate oxide layer between the substrate and the gate, the substrate including a channel region located generally below the gate;
The integrated circuit of claim 11, wherein the cap comprises nitride.
An integrated circuit comprising a plurality of transistors, a particular one of the transistors including a substrate, a gate, and a gate oxide layer between the substrate and the gate, the substrate including a channel region located generally below the gate, the channel region including a retrograde well of boron dopant.
Dependencies are inferred from the claim text.