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US 2005/0194607 A1Published application
High power light emitting diode
AssigneeWeldon Technologies, Inc.
InventorsThomas Barnett, Sean Tillinghast
Life of this patent
Estimating the term…
Abstract
An LED package is disclosed. The LED package comprises a base contact and a leadframe connected to the base contact. The leadframe includes an annular contact. An LED die is coupled to the base contact and the annular contact. A trim bezel is coupled to the leadframe. In carious embodiments the LED package may include a lens, and an optical material disposed over the LED die. The trim bezel may be colored to generally indicate the color of light emitted by the LED die.
Claims31
An LED package, comprising:
- a base contact;
- a leadframe connected to the base contact, the leadframe including an annular contact;
- and
- an LED die coupled to the base contact and the annular contact.
1 more element
An LED package, comprising:
- a base contact having a die cup for coupling to an LED die, a threaded portion for coupling to a complementary coupling device, and a dog point to aid in coupling the base contact to the complementary coupling device;
- a leadframe connected to the base contact, the leadframe including an annular contact;
- an LED die coupled to the die cup and the annular contact;
- an optical material disposed over the LED die;
- and
- a trim bezel coupled to the leadframe.
3 more elements
Dependencies are inferred from the claim text.