# US 2005/0190961 A1 · Method of manufacturing electronic components including a method for three dimensional inspection > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2005/0190961 A1 - Document ID: US20050190961A1 - Status: Published application - Kind: A1 - Application number: 11/069,918 - Filed: 2005-02-28 - Published: 2005-09-01 - Earliest claimed: 1998-01-16 - Assignees: Scanner Technologies Corporation - Inventors: Elwin Beaty; David Mork - Web page: https://patentgrep.com/patent/US20050190961A1 ## CPC - G06T 7/0002: {Inspection of images, e.g. flaw detection} - G06T 7/0004: {Industrial image inspection} - G06T 7/70: Determining position or orientation of objects or cameras (camera calibration G06T7/80) - G06T 7/80: Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration - H05K 13/0818: {Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts} - G06T 2200/04: involving 3D image data - G06T 2207/30148: Semiconductor; IC; Wafer - G06T 2207/30152: Solder - G06T 2207/30244: Camera pose - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A calibration and part inspection method for the inspection of ball grid array, BGA, devices. One or more cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into the camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by a single camera, or optionally, via additional cameras. The scene of the part can thus be triangulated and the dimensions of the BGA are determined. ## Claims ### Claim 1 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead; receiving at least the bottom view and the side perspective view of the lead using a single camera; transmitting the bottom view and the side perspective view of the lead to memory as pixel values; determining a first lead reference pixel position in the bottom view; determining a second lead reference pixel position in the side view; and converting the first and second lead reference pixel positions into a world value by using pixel values and parameters determined during a calibration. ### Claim 2 (depends on 1) The method of manufacturing of claim 1, wherein illuminating the lead is achieved using a single light source. ### Claim 3 (depends on 1) The method of manufacturing of claim 1, wherein illuminating the lead is achieved using more than one light source. ### Claim 4 (depends on 3) The method of manufacturing of claim 3, wherein the more than one light sources used are spectrally diverse from one another. ### Claim 5 (depends on 1) The method of manufacturing of claim 1, wherein the lead on the BGA device being inspected comprises a contact. ### Claim 6 (depends on 1) The method of manufacturing of claim 1, wherein the lead on the BGA device being inspected comprises a pin. ### Claim 7 (depends on 1) The method of manufacturing of claim 1, wherein the lead on the BGA device being inspected is selected from the group consisting of: bump contact, ball contact, pad, and pedestal. ### Claim 8 (depends on 1) The method of manufacturing of claim 1, wherein the bottom view of the lead and a side perspective view of the lead are obtained in a single image. ### Claim 9 (depends on 1) The method of manufacturing of claim 1, wherein the bottom view of the lead and a side perspective view of the lead are obtained in more than one image. ### Claim 10 (depends on 1) The method of manufacturing of claim 1, wherein the illuminating is with a diffuse light. ### Claim 11 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain both a bottom view of the lead and a side perspective view of the lead; receiving at least the bottom view and the side perspective view of the lead using a single camera; transmitting the bottom view and the side perspective view of the lead to memory as pixel values; determining a first lead reference pixel position in the bottom view; determining a second lead reference pixel position in the side view; and converting the first lead reference pixel position into a first world value and the second lead reference pixel position into a second world value by using pixel values and parameters determined during a calibration. ### Claim 12 (depends on 11) The method of manufacturing of claim 11, wherein illuminating the lead is achieved using a single light source. ### Claim 13 (depends on 11) The method of manufacturing of claim 11, wherein illuminating the lead is achieved using more than one light source. ### Claim 14 (depends on 13) The method of manufacturing of claim 13, wherein the more than one light sources used are spectrally diverse from one another. ### Claim 15 (depends on 11) The method of manufacturing of claim 11, wherein the lead on the BGA device being inspected comprises a contact. ### Claim 16 (depends on 11) The method of manufacturing of claim 11, wherein the lead on the BGA device being inspected comprises a pin. ### Claim 17 (depends on 11) The method of manufacturing of claim 11, wherein the lead on the BGA device being inspected is selected from the group consisting of: bump contact, ball contact, pad, and pedestal. ### Claim 18 (depends on 11) The method of manufacturing of claim 11, wherein the bottom view of the lead and a side perspective view of the lead are obtained in a single image. ### Claim 19 (depends on 11) The method of manufacturing of claim 11, wherein the bottom view of the lead and a side perspective view of the lead are obtained in more than one image. ### Claim 20 (depends on 11) The method of manufacturing of claim 11, wherein the illuminating is with a diffuse light. ### Claim 21 A method of manufacturing a ball grid array (BGA) device, the method comprising: combining an electronic circuit with a BGA package having a plurality of balls; making a three dimensional inspection of a lead on the BGA package with the ball grid array device being positioned in an optical system; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating at least one ball on the BGA package using a fixed illumination system; disposing a single sensor, a first optical element and a second optical element in relation to the BGA package so that the sensor obtains at least two differing views of the at least one ball, the sensor providing output representing the at least two differing views; and processing the output using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. ### Claim 22 (depends on 21) The method of manufacturing of claim 21, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. ### Claim 23 (depends on 21) The method of manufacturing of claim 21, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein an XY measurement value is proportional to a Z measurement value. ### Claim 24 (depends on 21) The method of manufacturing of claim 21, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein a Y measurement value is proportional to a Z measurement value. ### Claim 25 (depends on 21) The method of manufacturing of claim 21, wherein the triangulation method is based on determining a center of the ball in a first view and determining a ball top location in a second view. ### Claim 26 (depends on 21) The method of manufacturing of claim 21, wherein the pre-calculated calibration plane is defined by measuring a calibration pattern. ### Claim 27 (depends on 21) The method of manufacturing of claim 21, wherein one of the at least two differing views is obtained at a low angle of view. ### Claim 28 (depends on 21) The method of manufacturing of claim 21, wherein the sensor and the second optical element are positioned to receive light from different angles relative to the calibration plane. ### Claim 29 (depends on 21) The method of manufacturing of claim 21, wherein the processing includes applying grayscale edge detection to locate ball positions. ### Claim 30 (depends on 21) The method of manufacturing of claim 21, wherein the processing includes applying threshold analysis. ### Claim 31 (depends on 21) The method of manufacturing of claim 21, wherein the BGA device comprises a bump on wafer device. ### Claim 32 (depends on 21) The method of manufacturing of claim 21, wherein processing the output is carried out using a general purpose computer. ### Claim 33 (depends on 21) The method of manufacturing of claim 21, wherein one of the views comprises a segment having a crescent shape. ### Claim 34 (depends on 21) The method of manufacturing of claim 21, wherein the two different views of the at least one ball are obtained in a single image. ### Claim 35 (depends on 21) The method of manufacturing of claim 21, wherein the two different views of the at least one ball are each obtained in a separate image. ### Claim 36 A method of manufacturing a ball grid array (BGA) device, the method comprising: combining an electronic circuit with a BGA package having a plurality of balls; making a three dimensional inspection of a lead on the BGA package with the ball grid array device being positioned in an optical system; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the BGA package using a fixed illumination system; disposing a single sensor to receive light at a first angle relative to the BGA package; positioning a first optical element to transmit light to the sensor, where the sensor obtains a first view of the BGA package; disposing a second optical element to receive light at a second angle different from the first angle and to provide a second view of the BGA package to the sensor; transmitting image information from the sensor; and processing the image information by applying triangulation calculations to measurements of the image information so as to calculate a three dimensional position of at least one ball with reference to a pre-calculated calibration plane. ### Claim 37 (depends on 36) The method of manufacturing of claim 36, wherein the illuminating comprises illuminating with a ring light. ### Claim 38 (depends on 36) The method of manufacturing of claim 36, wherein the illuminating comprises illuminating with a plurality of light emitting diodes. ### Claim 39 (depends on 38) The method of manufacturing of claim 38, wherein at least two of the plurality of light emitting diodes are spectrally diverse from one another. ### Claim 40 (depends on 36) The method of manufacturing of claim 36, wherein the illuminating comprises illuminating with reflected light. ### Claim 41 (depends on 36) The method of manufacturing of claim 36, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. ### Claim 42 (depends on 36) The method of manufacturing of claim 36, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein an XY measurement value is proportional to a Z measurement value. ### Claim 43 (depends on 36) The method of manufacturing of claim 36, wherein the pre-calculated calibration plane comprises a coordinate system having X, Y and Z axes and wherein a Y measurement value is proportional to a Z measurement value. ### Claim 44 (depends on 36) The method of manufacturing of claim 36, wherein the pre-calculated calibration plane is defined by measuring a calibration pattern. ### Claim 45 (depends on 36) The method of manufacturing of claim 36, wherein the processing includes applying grayscale edge detection to locate ball positions. ### Claim 46 (depends on 36) The method of manufacturing of claim 36, wherein the processing includes applying threshold analysis. ### Claim 47 (depends on 36) The method of manufacturing of claim 36, wherein one of the views comprises a segment having a crescent shape. ### Claim 48 (depends on 36) The method of manufacturing of claim 36, wherein the first and second views of the at least one ball are obtained in a single image. ### Claim 49 (depends on 36) The method of manufacturing of claim 36, wherein the first and second views of the at least one ball are each obtained in a separate image. ### Claim 50 A method of manufacturing a ball grid array (BGA) device, the method comprising: combining an electronic circuit with a BGA package having a plurality of balls; making a three dimensional inspection of a lead on the BGA package with the ball grid array device being positioned in an optical system; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the BGA package using a fixed illumination system; taking a first image of the BGA package with a single camera disposed in a fixed focus position relative to the BGA package to obtain a circular doughnut shape image from at least one ball; taking a second image of the BGA package with an optical element disposed in a fixed focus position relative to the BGA package to transmit a side view image of the at least one ball to the camera; and processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. ### Claim 51 (depends on 50) The method of manufacturing of claim 50, wherein the second image comprises a segment having a crescent shape. ### Claim 52 (depends on 50) The method of manufacturing of claim 50, wherein the calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. ### Claim 53 (depends on 50) The method of manufacturing of claim 50, wherein the triangulation method to calculate a three dimensional position of the at least one ball is based on determining a center of the ball in the first image and determining a ball top location in the second image. ### Claim 54 (depends on 50) The method of manufacturing of claim 50, wherein the pre-calculated calibration plane is defined through measuring a calibration pattern. ### Claim 55 (depends on 50) The method of manufacturing of claim 50, wherein the second image is obtained at a low angle of view. ### Claim 56 (depends on 50) The method of manufacturing of claim 50, wherein the camera and the optical element are fixed at different angles relative to the calibration plane. ### Claim 57 (depends on 50) The method of manufacturing of claim 50, wherein processing the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 58 (depends on 50) The method of manufacturing of claim 50, wherein illuminating the ball grid array device employs diffuse illumination. ### Claim 59 (depends on 50) The method of manufacturing of claim 50, wherein the triangulation method uses state values derived from the ball grid array device. ### Claim 60 (depends on 50) The method of manufacturing of claim 50, wherein the processing includes applying threshold analysis. ### Claim 61 (depends on 50) The method of manufacturing of claim 50, wherein the at least one ball on the ball grid array device being inspected comprises a contact. ### Claim 62 (depends on 50) The method of manufacturing of claim 50, wherein the at least one ball on the ball grid array device being inspected comprises a pin. ### Claim 63 (depends on 50) The method of manufacturing of claim 50, wherein the at least one ball on the ball grid array device being inspected is selected from the group consisting of: bump contact, ball contact, pad, and pedestal. ### Claim 64 (depends on 50) The method of manufacturing of claim 50, wherein the circular doughnut shape image and the side view image comprise a single image. ### Claim 65 (depends on 50) The method of manufacturing of claim 50, wherein the circular doughnut shape image and the side view image each comprise a separate image. ### Claim 66 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain two differing views of the lead; disposing at least one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using parameters determined during a calibration. ### Claim 67 (depends on 66) The method of manufacturing of claim 66, wherein the lead on the BGA device being inspected comprises a contact. ### Claim 68 (depends on 66) The method of manufacturing of claim 66, wherein the lead on the BGA device being inspected is selected from the group consisting of: bump contact, ball contact, pin contact, pad, and pedestal. ### Claim 69 (depends on 66) The method of manufacturing of claim 66, wherein illuminating the lead is achieved using a single light source. ### Claim 70 (depends on 66) The method of manufacturing of claim 66, wherein illuminating the lead is achieved using more than one light source. ### Claim 71 (depends on 70) The method of manufacturing of claim 70, wherein the more than one light sources used are spectrally diverse from one another. ### Claim 72 (depends on 66) The method of manufacturing of claim 66, wherein the illuminating is with a diffuse light. ### Claim 73 (depends on 66) The method of manufacturing of claim 66, wherein the illuminating is with a ring light. ### Claim 74 (depends on 66) The method of manufacturing of claim 66, wherein the illuminating comprises illuminating with a plurality of light emitting diodes. ### Claim 75 (depends on 66) The method of manufacturing of claim 66, wherein a first view of the lead and a second view of the lead are obtained in a single image. ### Claim 76 (depends on 66) The method of manufacturing of claim 66, wherein a first view of the lead and a second view of the lead are obtained in two images. ### Claim 77 (depends on 66) The method of manufacturing of claim 66, wherein a first view of the lead and a second view of the lead are obtained in more than two images. ### Claim 78 (depends on 66) The method of manufacturing of claim 66, wherein the at least two differing views of the lead are obtained using a single sensor. ### Claim 79 (depends on 66) The method of manufacturing of claim 66, wherein the at least two differing views of the lead are obtained using two sensors. ### Claim 80 (depends on 66) The method of manufacturing of claim 66, wherein the at least two differing views of the lead are obtained using more than two sensors. ### Claim 81 (depends on 66) The method of manufacturing of claim 66, wherein the at least one sensor is selected from the group consisting of: digital camera, image sensor, charged coupled device array, and complementary metal-oxide semiconductor. ### Claim 82 (depends on 66) The method of manufacturing of claim 66, wherein one of the views comprises a segment having a donut shape. ### Claim 83 (depends on 66) The method of manufacturing of claim 66, wherein one of the views comprises a segment having a crescent shape. ### Claim 84 (depends on 66) The method of manufacturing of claim 66, wherein one of the views is obtained at a low angle of view. ### Claim 85 (depends on 66) The method of manufacturing of claim 66, wherein one of the views is obtained at a 0 degree angle of view. ### Claim 86 (depends on 66) The method of manufacturing of claim 66, wherein one of the views is obtained at a 90 degree angle of view. ### Claim 87 (depends on 66) The method of manufacturing of claim 66, wherein a displacement in a first view is proportional to a displacement in a second view. ### Claim 88 (depends on 66) The method of manufacturing of claim 66, wherein the first lead reference position determined from a center of the lead in a first view. ### Claim 89 (depends on 66) The method of manufacturing of claim 66, wherein the second lead reference position is determined from a top location of the lead in a second view. ### Claim 90 (depends on 66) The method of manufacturing of claim 66, wherein the first lead reference position is determined from a pixel position. ### Claim 91 (depends on 66) The method of manufacturing of claim 66, wherein the first lead reference position is determined from a world position. ### Claim 92 (depends on 66) The method of manufacturing of claim 66, wherein the second lead reference position is determined from a pixel position. ### Claim 93 (depends on 66) The method of manufacturing of claim 66, wherein the second lead reference position is determined from a world position. ### Claim 94 (depends on 66) The method of manufacturing of claim 66, wherein the first lead reference position is determined from grayscale edge detection. ### Claim 95 (depends on 66) The method of manufacturing of claim 66, wherein the first lead reference position is determined from threshold analysis. ### Claim 96 (depends on 66) The method of manufacturing of claim 66, wherein the first lead reference position is determined from convolution. ### Claim 97 (depends on 66) The method of manufacturing of claim 66, wherein the second lead reference position is determined from grayscale edge detection. ### Claim 98 (depends on 66) The method of manufacturing of claim 66, wherein the second lead reference position is determined from threshold analysis. ### Claim 99 (depends on 66) The method of manufacturing of claim 66, wherein the first second reference position is determined from convolution. ### Claim 100 (depends on 66) The method of manufacturing of claim 66, wherein converting the first and second lead reference positions into a world value is carried out using a triangulation calculation. ### Claim 101 (depends on 66) The method of manufacturing of claim 66, wherein converting the first and second lead reference positions into a world value is carried out using an interpolation calculation. ### Claim 102 (depends on 66) The method of manufacturing of claim 66, wherein converting the first and second lead reference positions into a world value is carried out using a general purpose computer. ### Claim 103 (depends on 66) The method of manufacturing of claim 66, wherein the world value comprises an X, Y, and Z position. ### Claim 104 (depends on 66) The method of manufacturing of claim 66, wherein the world value comprises a Z distance from a calibration plane. ### Claim 105 (depends on 66) The method of manufacturing of claim 66, wherein the world value comprises a Z distance from a regression plane. ### Claim 106 (depends on 66) The method of manufacturing of claim 66, wherein the world value comprises a Z distance from a seating plane. ### Claim 107 (depends on 66) The method of manufacturing of claim 66, wherein the parameters are determined by measuring a calibration pattern of known dimension and spacing. ### Claim 108 (depends on 66) The method of manufacturing of claim 66, wherein the parameters are determined by measuring a leads on a ball array device. ### Claim 109 (depends on 66) The method of manufacturing of claim 66, wherein the parameters define a calibration plane. ### Claim 110 (depends on 109) The method of manufacturing of claim 109, wherein the calibration plane comprises a coordinate system having X, Y and Z axes. ### Claim 111 (depends on 109) The method of manufacturing of claim 109, wherein the calibration plane is determined by measuring a calibration pattern. ### Claim 112 (depends on 109) The method of manufacturing of claim 109, wherein the calibration plane is determined by storing the locations of calibration dots in memory. ### Claim 113 (depends on 109) The method of manufacturing of claim 109, wherein the calibration plane is referenced to relate positions of differing views. ### Claim 114 (depends on 109) The method of manufacturing of claim 109, wherein the calibration plane is referenced to perform an interpolation function. ### Claim 115 (depends on 109) The method of manufacturing of claim 109, wherein the calibration plane is referenced to convert pixel values into world values. ### Claim 116 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing at least one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using parameters determined during a calibration. ### Claim 117 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing at least one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. ### Claim 118 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape; disposing at least one sensor to obtain the first and second views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. ### Claim 119 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape; disposing at least one sensor to obtain the first and second views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into an X, Y, and Z world value by using the locations of a calibration pattern stored in memory. ### Claim 120 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing a single sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using parameters determined during a calibration. ### Claim 121 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light that are spectrally diverse from one another; providing fixed optical elements to obtain two differing views of the lead; disposing a single sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using parameters determined during a calibration. ### Claim 122 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing a single one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. ### Claim 123 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light; providing fixed optical elements to obtain two differing views of the lead; disposing a single one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into an X, Y, and Z world value by using the locations of a calibration pattern stored in memory. ### Claim 124 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead with a ring light and a side light that are spectrally diverse from one another; providing fixed optical elements to obtain two differing views of the lead; disposing a single one sensor to obtain the two differing views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory. ### Claim 125 A method of manufacturing a ball grid array (BGA) device, the method comprising: placing an electronic circuit into a BGA package; making a three dimensional inspection of a lead on the BGA package; and selecting the combination of the electronic circuit placed inside the BGA package as a produced BGA device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the lead; providing fixed optical elements to obtain a first view of the lead that comprises a segment having a donut shape and a second view of the lead that comprises a segment having a crescent shape; disposing a single sensor to obtain the first and second views of the lead; transmitting the two differing views of the lead to memory; determining a first lead reference position in a first view; determining a second lead reference position in a second view; and converting the first and second lead reference positions into a world value by using the locations of a calibration pattern stored in memory.