# US 2005/0189657 A1 · Electronic component products and method of manufacturing electronic component products > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2005/0189657 A1 - Document ID: US20050189657A1 - Status: Published application - Kind: A1 - Application number: 11/069,758 - Filed: 2005-02-28 - Published: 2005-09-01 - Earliest claimed: 1998-01-16 - Assignees: Scanner Technologies Corporation - Inventors: Elwin Beaty; David Mork - Web page: https://patentgrep.com/patent/US20050189657A1 ## CPC - G06T 7/0002: {Inspection of images, e.g. flaw detection} - G06T 7/0004: {Industrial image inspection} - G06T 7/70: Determining position or orientation of objects or cameras (camera calibration G06T7/80) - G06T 7/80: Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration - H05K 13/0818: {Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts} - G06T 2207/30152: Solder - G06T 2207/30244: Camera pose - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A calibration and part inspection method for the inspection of ball grid array, BGA, devices. Two cameras image a precision pattern mask with dot patterns deposited on a transparent reticle. The precision pattern mask is used for calibration of the system. A light source and overhead light reflective diffuser provide illumination. A first camera images the reticle precision pattern mask from directly below. An additional mirror or prism located below the bottom plane of the reticle reflects the reticle pattern mask from a side view, through prisms or reflective surfaces, into a second camera and a second additional mirror or prism located below the bottom plane of the reticle reflects the opposite side view of the reticle pattern mask through prisms or mirrors into a second camera. By imaging more than one dot pattern the missing state values of the system can be resolved using a trigonometric solution. The reticle with the pattern mask is removed after calibration and the BGA to be inspected is placed with the balls facing downward, in such a manner as to be imaged by the two cameras. The scene of the part can thus be triangulated and the dimensions of the BGA are determined. ## Claims ### Claim 1 A ball array device produced according to a process comprising: combining an electronic circuit with a ball array package having a plurality of balls; making a three dimensional inspection of a lead on the ball array package with the ball grid array device being positioned in a fixed optical system; and selecting the combination of the electronic circuit and the ball array package as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the ball array package; taking a first image of the ball array package with a first camera disposed in a fixed focus position relative to the ball array package to obtain a characteristic circular doughnut shape image from at least one ball; taking a second image of the ball array package with a second camera disposed in a fixed focus position relative to the ball array package to obtain a side view image of the at least one ball; and processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. ### Claim 2 (depends on 1) The ball array device of claim 1, wherein the second image comprises a segment having a crescent shape. ### Claim 3 (depends on 1) The ball array device of claim 1, wherein the calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. ### Claim 4 (depends on 1) The ball array device of claim 1, wherein the triangulation method to calculate a three dimensional position of the at least one ball is based on determining a center of the ball in the first image and determining a ball top location in the second image. ### Claim 5 (depends on 1) The ball array device of claim 1, wherein the pre-calculated calibration plane is defined through measuring a calibration pattern. ### Claim 6 (depends on 1) The ball array device of claim 1, wherein the taking a second image further comprises interposing a mirror between the ball array device and the second camera. ### Claim 7 (depends on 1) The ball array device of claim 1, wherein the second image is obtained at a low angle of view. ### Claim 8 (depends on 1) The ball array device of claim 1, wherein the first camera and the second camera are fixed at different angles relative to the calibration plane. ### Claim 9 (depends on 1) The ball array device of claim 1, wherein the processing measurements from the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 10 (depends on 1) The ball array device of claim 1, wherein the illuminating the ball array device comprises employing diffuse illumination. ### Claim 11 (depends on 1) The ball array device of claim 1, wherein the ball array devices comprise ball grid array devices. ### Claim 12 (depends on 1) The ball array device of claim 1, wherein the ball array devices comprise bump on wafer devices. ### Claim 13 (depends on 1) The ball array device of claim 1, wherein illuminating is achieved using a single light source. ### Claim 14 (depends on 1) The ball array device of claim 1, wherein illuminating is achieved using more than one light source. ### Claim 15 (depends on 14) The ball array device of claim 14, wherein the more than one light sources used are spectrally diverse from one another. ### Claim 16 A ball array device produced according to a process comprising: combining an electronic circuit with a ball array package having a plurality of balls; making a three dimensional inspection of a lead on the ball array package with the ball grid array device being positioned in an optical system; and selecting the combination of the electronic circuit and the ball array package as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the ball array package to produce reflections; taking a first image of the reflections with a first camera disposed in a first fixed position to obtain a circular doughnut shape image of the ball array package; taking a second image of the reflections with a second camera disposed in a second fixed position non-parallel to the first fixed position to obtain a side view of the ball array package; and processing measurements from the first image and the second image to calculate a three dimensional position of at least one ball using a triangulation method with reference to a pre-calculated calibration plane. ### Claim 17 (depends on 16) The ball array device of claim 16, wherein the second image comprises a segment having a crescent shape. ### Claim 18 (depends on 16) The ball array device of claim 16, wherein the calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. ### Claim 19 (depends on 16) The ball array device of claim 16, wherein the pre-calculated calibration plane is defined through measuring a calibration pattern. ### Claim 20 (depends on 16) The ball array device of claim 16, wherein the taking a second image further comprises interposing a mirror between the ball array device and the second camera. ### Claim 21 (depends on 16) The ball array device of claim 16, wherein the processing measurements from the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 22 (depends on 16) The ball array device of claim 16, wherein the processing measurements from the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 23 (depends on 16) The ball array device of claim 16, wherein the illuminating the ball array device comprises employing diffuse illumination. ### Claim 24 (depends on 16) The ball array device of claim 16, wherein the ball array devices comprise ball grid array devices. ### Claim 25 (depends on 16) The ball array device of claim 16, wherein the ball array devices comprise bump on wafer devices. ### Claim 26 (depends on 16) The ball array device of claim 16, wherein illuminating is achieved using a single light source. ### Claim 27 (depends on 16) The ball array device of claim 16, wherein illuminating is achieved using more than one light source. ### Claim 28 (depends on 27) The ball array device of claim 27, wherein the more than one light sources used are spectrally diverse from one another. ### Claim 29 A ball array device produced according to a process comprising: combining an electronic circuit with a ball array package having a plurality of balls; making a three dimensional inspection of a lead on the ball array package with the ball grid array device being positioned in an optical system; and selecting the combination of the electronic circuit and the ball array package as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the ball array package; taking a first image of the ball array package with a first camera disposed in a first fixed position relative to the ball array package to obtain a circular doughnut shape view of the ball array package, wherein the first camera includes a charged coupled device array; taking a second image of the ball array package with a second camera disposed in a second fixed position non-parallel to the first fixed position to obtain a side view of the ball array package, wherein a fixed mirror is interposed to reflect light between the ball array package and the second camera, and wherein the second camera includes a charged coupled device array; and processing measurements from the first image and the second image to calculate a three dimensional position of at least one ball using a triangulation method with reference to a pre-calculated calibration plane, wherein the calibration plane comprises a coordinate system having X, Y and Z axes, and wherein an X measurement value is proportional to a Z measurement value. ### Claim 30 (depends on 29) The ball array device of claim 29, wherein the second image comprises a segment having a crescent shape. ### Claim 31 (depends on 29) The ball array device of claim 29, wherein the pre-calculated calibration plane is defined through measuring a calibration pattern. ### Claim 32 (depends on 29) The ball array device of claim 29, wherein the processing measurements from the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 33 (depends on 29) The ball array device of claim 29, wherein the illuminating the ball array device comprises employing diffuse illumination. ### Claim 34 (depends on 29) The ball array device of claim 29, wherein the ball array devices comprise ball grid array devices. ### Claim 35 (depends on 29) The ball array device of claim 29, wherein the ball array devices comprise bump on wafer devices. ### Claim 36 A method of manufacturing a ball array device, the method comprising: combining an electronic circuit with a ball array package having a plurality of balls; making a three dimensional inspection of a lead on the ball array package with the ball grid array device being positioned in a fixed optical system; and selecting the combination of the electronic circuit placed inside the ball array package as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating the ball array package; taking a first image of the ball array package with a first camera disposed in a fixed focus position relative to the ball array package to obtain a characteristic circular doughnut shape image from at least one ball; taking a second image of the ball array package with a second camera disposed in a fixed focus position relative to the ball array package to obtain a side view image of the at least one ball; and processing the first image and the second image using a triangulation method to calculate a three dimensional position of the at least one ball with reference to a pre-calculated calibration plane. ### Claim 37 (depends on 36) The method of manufacturing of claim 36, wherein the second image comprises a segment having a crescent shape. ### Claim 38 (depends on 36) The method of manufacturing of claim 36, wherein the calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. ### Claim 39 (depends on 36) The method of manufacturing of claim 36, wherein the triangulation method to calculate a three dimensional position of the at least one ball is based on determining a center of the ball in the first image and determining a ball top location in the second image. ### Claim 40 (depends on 36) The method of manufacturing of claim 36, wherein the pre-calculated calibration plane is defined through measuring a calibration pattern. ### Claim 41 (depends on 36) The method of manufacturing of claim 36, wherein the taking a second image further comprises interposing a mirror between the ball array device and the second camera. ### Claim 42 (depends on 36) The method of manufacturing of claim 36, wherein the second image is obtained at a low angle of view. ### Claim 43 (depends on 36) The method of manufacturing of claim 36, wherein the first camera and the second camera are fixed at different angles relative to the calibration plane. ### Claim 44 (depends on 36) The method of manufacturing of claim 36, wherein the processing measurements from the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 45 (depends on 36) The method of manufacturing of claim 36, wherein the illuminating the ball array device comprises employing diffuse illumination. ### Claim 46 (depends on 36) The method of manufacturing of claim 36, wherein the ball array devices comprise ball grid array devices. ### Claim 47 (depends on 36) The method of manufacturing of claim 36, wherein the ball array devices comprise bump on wafer devices. ### Claim 48 (depends on 36) The method of manufacturing of claim 36, wherein illuminating is achieved using a single light source. ### Claim 49 (depends on 36) The method of manufacturing of claim 36, wherein illuminating is achieved using more than one light source. ### Claim 50 (depends on 49) The method of manufacturing of claim 49, wherein the more than one light sources used are spectrally diverse from one another. ### Claim 51 A method of manufacturing a ball array device, the method comprising: combining an electronic circuit with a ball array package having a plurality of balls; making a three dimensional inspection of a lead on the ball array package with the ball grid array device being positioned in an optical system; and selecting the combination of the electronic circuit placed inside the ball array package as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating a ball array package to produce reflections; taking a first image of the reflections with a first camera disposed in a first fixed position to obtain a circular doughnut shape image of the ball array package; taking a second image of the reflections with a second camera disposed in a second fixed position non-parallel to the first fixed position to obtain a side view of the ball array package; and processing measurements from the first image and the second image to calculate a three dimensional position of at least one ball using a triangulation method with reference to a pre-calculated calibration plane. ### Claim 52 (depends on 51) The method of manufacturing of claim 51, wherein the second image comprises a segment having a crescent shape. ### Claim 53 (depends on 51) The method of manufacturing of claim 51, wherein the calibration plane comprises a coordinate system having X, Y and Z axes and wherein an X measurement value is proportional to a Z measurement value. ### Claim 54 (depends on 51) The method of manufacturing of claim 51, wherein the pre-calculated calibration plane is defined through measuring a calibration pattern. ### Claim 55 (depends on 51) The method of manufacturing of claim 51, wherein the taking a second image further comprises interposing a mirror between the ball array device and the second camera. ### Claim 56 (depends on 51) The method of manufacturing of claim 51, wherein the processing measurements from the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 57 (depends on 51) The method of manufacturing of claim 51, wherein the processing measurements from the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 58 (depends on 51) The method of manufacturing of claim 51, wherein the illuminating the ball array device comprises employing diffuse illumination. ### Claim 59 (depends on 51) The method of manufacturing of claim 51, wherein the ball array devices comprise ball grid array devices. ### Claim 60 (depends on 51) The method of manufacturing of claim 51, wherein the ball array devices comprise bump on wafer devices. ### Claim 61 (depends on 51) The method of manufacturing of claim 51, wherein illuminating is achieved using a single light source. ### Claim 62 (depends on 51) The method of manufacturing of claim 51, wherein illuminating is achieved using more than one light source. ### Claim 63 (depends on 62) The method of manufacturing of claim 62, wherein the more than one light sources used are spectrally diverse from one another. ### Claim 64 A method of manufacturing a ball array device, the method comprising: combining an electronic circuit with a ball array package having a plurality of balls; making a three dimensional inspection of a lead on the ball array package with the ball grid array device being positioned in an optical system; and selecting the combination of the electronic circuit placed inside the ball array package as a produced ball array device based upon the results of the three dimensional inspection; wherein the three dimensional inspection comprises: illuminating a ball array package; taking a first image of the ball array package with a first camera disposed in a first fixed position relative to the ball array package to obtain a circular doughnut shape view of the ball array package, wherein the first camera includes a charged coupled device array; taking a second image of the ball array device with a second camera disposed in a second fixed position non-parallel to the first fixed position to obtain a side view of the ball array package, wherein a fixed mirror is interposed to reflect light between the ball array package and the second camera, and wherein the second camera includes a charged coupled device array; and processing measurements from the first image and the second image to calculate a three dimensional position of at least one ball using a triangulation method with reference to a pre-calculated calibration plane, wherein the calibration plane comprises a coordinate system having X, Y and Z axes, and wherein an X measurement value is proportional to a Z measurement value. ### Claim 65 (depends on 64) The method of manufacturing of claim 64, wherein the second image comprises a segment having a crescent shape. ### Claim 66 (depends on 64) The method of manufacturing of claim 64, wherein the pre-calculated calibration plane is defined through measuring a calibration pattern. ### Claim 67 (depends on 64) The method of manufacturing of claim 64, wherein the processing measurements from the first image and the second image comprises employing grayscale edge detection to locate ball positions. ### Claim 68 (depends on 64) The method of manufacturing of claim 64, wherein the illuminating the ball array device comprises employing diffuse illumination. ### Claim 69 (depends on 64) The method of manufacturing of claim 64, wherein the ball array devices comprise ball grid array devices. ### Claim 70 (depends on 64) The method of manufacturing of claim 64, wherein the ball array devices comprise bump on wafer devices.