# US 2005/0173792 A1 · Structure for isolating thermal interface material

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- Number: US 2005/0173792 A1
- Document ID: US20050173792A1
- Status: Published application
- Kind: A1
- Application number: 11/039,725
- Filed: 2005-01-19
- Published: 2005-08-11
- Earliest claimed: 2004-02-10
- Assignees: Uniwill Computer Corp.
- Inventors: Young-Kwang Sheu; Fu-Chien Yu; Hung-Ming Lin; Chia-Tseng Huang
- Web page: https://patentgrep.com/patent/US20050173792A1

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A structure for isolating thermal interface material includes an isolating element and a heat dissipating element. The isolating element is hollow to encompass a heat generating element. With compression of the heat dissipating element on the heat generating element, thermal interface material between them is limited to flow within the closed room between the isolation element and heat generating element. The heat dissipating element further has a bump exactly contacting the heat generating element and a little smaller than the hollow portion of the isolating element. Therefore, the thermal interface material would not overflow while changing from solid phase to a gel or a liquid phase caused by raising temperature of the heat generating element, and the contamination or short circuits can be prevented.

## Claims

### Claim 1

A structure for isolating thermal interface material, comprising:
an isolating element that is hollow and provided around a heat generating element;
a heat dissipating element contacting the isolating element and having a bump formed on one face thereof and contacting the heat generating element with thermal interface material between them to absorb heat generated by the heat generating element, the thermal interface material being limited to flow within a encompassed room defined between the isolating element and the heat generating element.

### Claim 2 (depends on 1)

The structure for isolating thermal interface material of claim 1, wherein the bump is able to contact the heat generating element after the heat dissipating element contacts the heat generating element so as to prevent the isolating element from being overly compressed by the heat dissipating element.

### Claim 3 (depends on 2)

The structure for isolating thermal interface material of claim 2, wherein the isolating element is able to encompass the bump.

### Claim 4 (depends on 1)

The structure for isolating thermal interface material of claim 1, wherein the isolating element is made of flexible material.

### Claim 5 (depends on 4)

The structure for isolating thermal interface material of claim 4, wherein the isolating element is made of porous material.

### Claim 6 (depends on 1)

The structure for isolating thermal interface material of claim 1, wherein the dimension and height of the isolating element is larger than that of the heat generating element.

### Claim 7 (depends on 1)

The structure for isolating thermal interface material of claim 1, wherein a recess is defined in the face of heat dissipating element and around the bump to receive the isolating element therein.

### Claim 8 (depends on 1)

The structure for isolating thermal interface material of claim 1, wherein the thermal interface material changes its solid phase to liquid phase with respect to temperature change in the heat generating element.

### Claim 9 (depends on 1)

The structure for isolating thermal interface material of claim 1, wherein the thermal interface material changes its solid phase to gel phase with rising temperature in the heat generating element.

### Claim 10 (depends on 1)

The structure for isolating thermal interface material of claim 1, wherein the heat generating element is an electronic component.