Linear via punch

A process for punching and filling vias in a substrate comprising the steps of:

• a) fabricating a die having a full array hole pattern using a via fill mask and having said full array hole pattern corresponding to a pattern on said a via fill mask;
• b) placing the substrate on the die and fixing the substrate to the die;
• c) fabricating a punch head having a fixed punch pattern corresponding to a portion of the pattern on the via fill mask;
• d) positioning the substrate and the die at a position below the punch head by extending an alignment pin from said punch head to an alignment hole in said die, and moving said punch head such that said alignment pin moves in said alignment hole, wherein said alignment hole is sufficiently larger than said alignment pin to permit the punch head to contact a top surface of the substrate and articulate in the x-, y-, and theta directions;
• e) punching at least one via in the substrate corresponding to the hole pattern of the die;
• f) stepping the substrate and the die to a further position below the punch head;
• g) repeating steps e) and f) until the hole pattern is complete;
• and
• h) filling said via from a side of said substrate facing said die.

A process for punching and filling vias in a substrate comprising the steps of:

• a) fabricating a die having a full array hole pattern using a via fill mask and having said full array hole pattern corresponding to a pattern on said via fill mask;
• b) placing the substrate on the die;
• c) detachably fixing the substrate to the die;
• d) fabricating a punch head having a fixed punch pattern corresponding to a portion of the pattern on the via fill mask;
• e) positioning the substrate and the die at a position below the punch head;
• f) aligning the substrate and the die with the punch head by extending an alignment pin from said punch head to an alignment hole in said die, and moving said punch head such that said alignment pin moves in said alignment hole, wherein said alignment hole is sufficiently larger than said alignment pin to permit the punch head to contact a top surface of the substrate and articulate in the x-, y-, and theta directions;
• g) punching at least one via in the substrate corresponding to the hole pattern of the die;
• h) stepping the substrate and the die to a further position below the punch head;
• i) repeating steps f), g), and h) until the hole pattern is complete;
• and
• j) filling said via from a side of said substrate facing said die.

A process for punching and filling vias in a substrate comprising the steps of:

• a) fabricating a die having a full array hole pattern using a via fill mask and having said full array hole pattern corresponding to a pattern on said a via fill mask;
• b) placing the substrate on the die;
• c) detachably fixing the substrate to the die;
• d) fabricating a punch head having a fixed punch pattern corresponding to a portion of the pattern on the via fill mask;
• e) positioning the substrate and the die at a position below the punch head;
• f) aligning the substrate and the die with the punch head by extending an alignment pin from said punch head to an alignment hole in said die, and moving said punch head such that said alignment pin moves in said alignment hole, wherein said alignment hole is sufficiently larger than said alignment pin to permit the punch head to contact a top surface of the substrate and articulate in the x-, y-, and theta directions;
• g) placing the punch head in contact with a top surface of the substrate;
• h) articulating the punch head in at least one of an x position, a y position, and a theta position with respect to said die;
• i) punching at least one via in the substrate corresponding to the hole pattern of the die;
• j) stepping the substrate and the die to a further position below the punch head;
• k) repeating steps f) through j) until the hole pattern is complete;
• and
• l) filling said via from a side of said substrate facing said die.