Semiconductor device and method of manufacting the same, electronic module, and electronic instrument
AssigneeSeiko Epson Corporation
InventorTatsuhiro Urushido
Life of this patent
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Abstract
A semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads. The first group of leads extends in a direction away from the second group of electrodes. Each of the second group of leads extends so as to pass between the first group of electrodes and is formed to be bent in the region between first and second straight lines.
Claims9
A semiconductor device comprising:
- a substrate on which first and second groups of leads are formed;
- and
- a semiconductor chip which includes first and second groups of electrodes arranged respectively on both sides of a region between first and second parallel straight lines,
- wherein the semiconductor chip is mounted on the substrate so that the first group of electrodes faces the first group of leads and the second group of electrodes faces the second group of leads,
- wherein the first group of leads extends in a direction away from the second group of electrodes, and
- wherein each of the second group of leads extends so as to pass between the first group of electrodes and is formed to be bent in the region between first and second straight lines.
An electronic module to which the semiconductor device as defined in claim I is attached.
A method of manufacturing a semiconductor device, comprising:
- (a) heating and expanding a substrate on which first and second groups of leads are formed and a semiconductor chip which includes first and second groups of electrodes arranged respectively on both sides of a region between first and second parallel straight lines;
- (b) bonding each of the first group of electrodes to one of the first group of leads, and bonding each of the second group of electrodes to a first portion of one of the second group of leads;
- and
- (c) causing the semiconductor chip and the substrate to release heat and shrink,
- wherein, before the step (b), each of the second group of leads further includes a bent portion extending from the first portion and a second portion extending from the bent portion, at least the second portion adhering to the substrate,
- wherein, in the step (b), the first group of leads is disposed so as to extend from joint sections with the first group of electrodes in a direction opposite to the second group of electrodes, and each of the second group of leads is disposed so that the first portion faces one of the second group of electrodes, the bent portion is disposed in the region between the first and second straight lines, and the second portion passes between the first group of electrodes, and
- wherein the step (c) includes:
- (c1) causing the semiconductor chip to shrink at a percentage greater than a percentage of the substrate, and causing the bent portion to be deformed by applying force in a shrinkage direction to the bent portion through the first portion bonded to one of the second group of electrodes by the shrinkage force;
- and
- (c2) causing the substrate to shrink at a percentage greater than a percentage of the semiconductor chip, and causing the bent portion to be deformed by applying force in a shrinkage direction to the second portion adhering to the substrate by the shrinkage force.
Dependencies are inferred from the claim text.