US 2005/0121598 A1 · Pixel sensor array and method of manufacture thereof

Abstract

A sensor array having a plurality of pixels each including a sensor element coupled to a sensor input (24) of an electronic processing circuit is fabricated by first forming an integrated circuit having at least one array of electronic processing circuits (25, 26) each having a respective sensor input (24) disposed with terminal nodes of the integrated circuit toward a first surface of the wafer. In respect of either each pixel or each terminal node, an electrically conductive via (31) is formed through the wafer (20) extending from either the respective sensor input (24) or from the respective terminal node to a second surface (28) of the wafer opposite the first surface. This allows each electrically conductive via (31) exposed at the second surface of the wafer to serve for connection thereto of either a sensor element or a terminal connection that is electrically connected through the electrically conductive via (31) to the respective sensor input or terminal node.

Claims52

Dependent claims

A method for fabricating a sensor array having a plurality of pixels, each pixel including an electronic processing circuit having a sensor input for coupling a sensor element to the electronic processing circuit, the sensor array further having a plurality of terminal nodes for external connection to respective electronic processing circuits of multiple pixels of power, I/O and control connections, the method comprising:

integrating the electronic processing circuits on a wafer so as to form an integrated circuit having at least one array of said electronic processing circuits with the sensor inputs and the terminal nodes being accessible from a first surface of the wafer;
in respect of each pixel, providing an electrically conductive via through the wafer extending from the respective sensor input to a second surface of the wafer opposite the first surface;
depositing sensor material on the second surface of the wafer so that an unexposed surface thereof forms multiple electrodes each in registration with a corresponding one of the electrically conductive vias.

integrating the electronic processing circuits on a wafer so as to form an integrated circuit having at least one array of said electronic processing circuits with the sensor inputs being accessible from a first surface of the wafer;
providing a plurality of electrically conductive vias through the wafer extending to a second surface of the wafer opposite the first surface, each of said electrically conductive vias being in registration with a respective terminal node in the sensor array;
and
depositing sensor material on the first surface of the wafer so that an unexposed surface thereof forms multiple electrodes each in registration with the respective sensor input of a corresponding electronic processing circuit.

1 more element

Dependencies are inferred from the claim text.

Pixel sensor array and method of manufacture thereof

Life of this patent

Pixel sensor array and method of manufacture thereof

Life of this patent

Abstract

Claims52