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US 2005/0121314 A1Published application
Electrolytic plating method and device for a wiring board
AssigneeKabushiki Kaisha Toyoda Jidoshokki Seisakusho
InventorsToshiki Inoue, Kyoko Kumagai
Life of this patent
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Abstract
A plating bath which accommodates an insoluble node and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode Is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.
Claims6
1-6. (canceled)
An electrolytic plating device, comprising;
- a wiring board with microvia holes, each having a bottom made of copper foil provided on a surface of the wiring board as an electrode;
- an insoluble electrode, which is an electrode opposed to the wiring board;
- a metal plating solution containing iron ions of at least 0.1 gram/liter;
- a power source for performing electrolytic plating by applying a forward/reverse current between the wiring board and said insoluble electrode;
- and
- a stirring unit stirring said metal plating solution to make the solution flow in parallel to the surface to be plated of said wiring board so that the microvia holes having the copper foil at the bottom, which are formed on the surface of said wiring board, may be filled up with said metal plating.
3 more elements
Dependencies are inferred from the claim text.