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US 2005/0089593 A1Published application
Molding apparatus with a pressure sensor for packaging semiconductor device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsWei-Chih Wang, Kuang-Lin Lo, Yun-Lung Chang
Life of this patent
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Abstract
A molding apparatus mainly comprises a mold chase holder, a mold chase, a heater and a pressure sensor. The mold chase comprises a mold cavity and a via, wherein the via penetrates the mold-cavity surface of the mold cavity. The mold chase is accommodated by a mold chase holder and there is a heater, for heating the mold chase up, disposed therein. And the pressure sensor for measuring the viscosity of the instant molding flow at the mold-cavity surface of the mold cavity is provided in the via of the mold chase.
Claims4
A molding apparatus, comprising:
- a mold chase, the mold chase having a mold cavity wherein the mold cavity has a mold-cavity surface;
- a mold chase holder;
- and
- a pressure sensor disposed in the mold chase.
1 more element
Dependencies are inferred from the claim text.