Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards

A method of producing an opto-electronic package facilitating the passive alignment of VCSELs to waveguides;

• said method comprising:
• providing a core having a first surface;
• positioning a first cladding layer on said first surface of said core;
• arranging a contact pad on at least a portion of the surface of said first cladding layer;
• locating a second cladding layer on a further surface portion of said first cladding layer;
• positioning a waveguide channel in said second cladding layer;
• and
• providing optical means in optical communication with said waveguide channel in said second cladding layer and in electrical connection with said contact pad on said first cladding layer.

An opto-electronic package for alignment of a VCSEL to a waveguide, said package comprising:

• a first dielectric layer;
• a first signal conductor on said first dielectric layer;
• a second dielectric layer overlying said first signal conductor and exposed portions of said first dielectric layer;
• an optical waveguide within and parallel to said second dielectric layer;
• a third dielectric layer on said second dielectric layer for mounting an optical device;
• and wherein:
• there is an opening through said third dielectric layer to permit an optical path between said optical device and said waveguide;
• and
• there is an opening through said second and third dielectric layers to permit an electrical connection of said optical device to said first signal conductor.