Electron beam lens for micro-column electron beam apparatus and method of fabricating the same
AssigneeElectronics and Telecommunications Research Institute
InventorsSang Choi, Dae Kim
Life of this patent
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Abstract
Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.
Claims16
An electron beam lens comprising:
- a plurality of conductive thin films, each having a hole through which electron beam passes;
- and
- a plurality of base isolation substrates disposed between the conductive thin films, each of the base isolation substrate having hollowed spaces larger than the holes,
- wherein the base isolation substrates are photosensitive glass substrates in which the hollowed spaces are formed by etching activated regions formed by exposing the base isolation substrate to light, the conductive thin films are metal plating layers grown on the base isolation substrates, and the holes are each formed by forming a resist pattern on the base isolation substrate along a central line of an electron beam path, growing the metal plating layer on the base isolation substrate, and then performing a lift-off method to remove the resist pattern, so that the holes are self aligned along the central line of an electron beam path.
A method of manufacturing an electron beam lens, comprising:
- focusing a light onto a region with a shape of a hollowed space to form an activated region in a central portion of a photosensitive glass substrate;
- forming a seed metal layer on at least one surface of the photosensitive glass substrate;
- forming a resist pattern with a shape of a hole on the central portion of the seed metal layer;
- forming a metal plating layer on a region of the seed metal layer on the resist pattern;
- removing the resist pattern using a lift off process;
- forming a thin metal film having a hole on the photosensitive glass substrate by removing a portion of the seed metal layer that has covered by the resist pattern;
- and
- forming a hollowed space by etching the activated region on the photosensitive glass substrate.
The method of claims either 5 or 7, wherein the processes between focusing the light on the photosensitive substrate and forming the thin metal film by removing the portion of the seed metal layer are performed on each of a plurality of photosensitive glass substrates, and the forming of a hollowed space is performed after bonding the plurality of photosensitive glass substrates together.
A method of manufacturing an electron beam comprising:
- focusing a light onto a region with a shape of a first hollowed space to form an activated region on a central portion of a first photosensitive glass substrate;
- forming a first seed metal layer on a first surface of the first photosensitive glass substrate and forming a second seed metal layer on a second surface of the first photosensitive glass substrate;
- forming a first resist pattern with a shape of a first hole on the first seed metal layer;
- forming a second resist pattern with a shape of a second hole that is aligned with the first resist pattern on the second seed metal layer;
- forming a first metal plating layer on a portion of the first seed metal layer exposed by the first resist pattern;
- forming a second metal plating layer on a portion of the second seed metal layer exposed by the second resist pattern;
- removing the first and the second resist patterns using a lift off method;
- forming first and second thin metal films having the first hole and the second hole, respectively, by removing portions of the seed metal layers that were covered by the first and second resist patterns;
- forming a first hollowed space by etching the activated region of the first photosensitive glass substrate;
- focusing a light onto a region with a shape of a second hollowed space to form an activated region of a central portion of a second photosensitive glass substrate;
- forming a third thin metal plating layer that exposes a second hollowed space on first surface of the second photosensitive glass substrate and forming a third seed metal layer on a second surface of the second photosensitive glass substrate;
- bonding the second thin metal film of the first photosensitive glass substrate and the third thin metal film of the second photosensitive glass substrate using a eutectic bonding method;
- forming a third resist pattern with a shape of a third hole that is aligned with the first and second resist patterns on the third seed metal layer;
- forming a third metal plating layer on a portion of the third seed metal layer exposed by the third resist pattern;
- removing the third resist pattern using a lift off method;
- forming a third thin metal film having the third hole by removing a portion of the third seed metal layer that is covered by the third resist pattern;
- and
- forming a second hollowed space by etching the activated region of the second photosensitive glass substrate.
Dependencies are inferred from the claim text.