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AssigneeInternational Business Machines Corporation
InventorsMark Chace, Jeffrey Hedrick, Habib Hichri, Keith Pope, Jia Lee, Kelly Malone, Kenneth McCullough, Wayne Moreau, Darryl Restaino, Shahab Siddiqui
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A process of removing impurities from a cured low dielectric constant organic polymeric film disposed on a semiconductor device. The process involves disposing a low dielectric constant curable organic polymeric film on an electrically conductive surface of a semiconductor device. The organic polymeric film is cured on the semiconductor device and thereupon contacted with supercritical carbon dioxide, optionally in the presence of at least one cosolvent.
A process of removing impurities from a cured low dielectric constant organic polymeric film disposed on a semiconductor device comprising disposing a low dielectric constant curable organic polymeric film on an electrically conductive surface of a semiconductor device;
A process in accordance with Clam 16 wherein said solvent is present in a concentration in a range between about 1% and about 50%.
Dependencies are inferred from the claim text.