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OwnerToshio Haba, Takeyuki Itabashi +2inventors
InventorsToshio Haba, Takeyuki Itabashi, Haruo Akahoshi, Shinichi Fukada
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An object of the present invention is to improve the reliability and the yield of production of semiconductor integrated circuit devices by filling copper in the inside of features having a high aspect ratio for forming multi-layer interconnections composed of a plurality of interconnection layers which are connected to one another and to a copper electroplating bath suitable therefor. In the present invention, when the features are filled with copper, the use of a copper electroplating bath with an addition of cyanine dyes, for example, indolium compounds allows the copper plating to proceed preferentially from the bottoms of the features.
A copper electroplating solution containing copper ions, at least one electrolyte, and at least one cyanine dye, wherein said at least one cyanine dye suppresses an electroplating reaction during use of the copper electroplating solution for electroplating, and said at least one cyanine dye is present in the solution in a concentration of 1-15 mg/L.
A copper electroplating solution containing copper ions, at least one electrolyte, and at least one indolium compound, wherein said at least one indolium compound suppresses an electroplating reaction during use of the copper electroplating solution for electroplating, and said at least one indolium compound is present in the solution in a concentration of 1-15 mg/L.
A copper electroplating solution containing copper ions, at least one electrolyte and at least one of the compounds represented by the following general formula
A copper electroplating solution containing copper ions, at least one electrolyte, and an additive selected from the group consisting of (a) cyanine dyes, (b) indolium compounds, and (c) compounds represented by the following general formula (I):
Dependencies are inferred from the claim text.