Insertion of electrical component within a via of a printed circuit board
AssigneeInternational Business Machines Corporation
InventorsTimothy Crockett, Harry Minikel
Life of this patent
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Abstract
A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.
Claims12
1-29. (canceled)
A method for saving space in a printed circuit board comprising the steps of:
- forming said printed circuit board comprising a plurality of conductive layers, wherein said printed circuit board further comprises two or more vias interconnecting two or more conductive layers of said plurality of conductive layers;
- and
- embedding an electrical component in a particular via between two conductive layers of said plurality of conductive layers.
Dependencies are inferred from the claim text.