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AssigneeTokyo Electron Limited
InventorsMichio Tanaka, Makoto Kiyota, Takashi Aiuchi, Ryouichi Uemura
Estimating the term…
When a base film of a substrate is formed, for instance, on a scribe line of a wafer, a quadrangular first inspection pattern is formed in advance, and when a resist pattern is formed, a second inspection pattern are formed so as to be on a straight line to the first inspection pattern in a top plan view. When light is irradiated to a region including the first inspection pattern and the second inspection pattern and a spectrum is formed based on the reflected diffracted light, information of a line width of the second inspection pattern and a pitch of both inspection patterns is contained therein. In this connection, by preparing in advance a group of spectra based on various kinds of inspection patterns according to simulation and by comparing with an actual spectrum, the most approximate spectrum is selected, and thereby the line width and the pitch are estimated to evaluate the resist pattern.
A substrate inspection apparatus for inspecting a substrate with a resist being coated on a surface thereof and the coated resist being performed with exposing and developing process, comprising:
A substrate inspection method for inspecting a substrate with a resist being coated on a surface thereof and the coated resist being performed with exposing and developing process, comprising:
Dependencies are inferred from the claim text.