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US 2005/0038554 A1Published application
Inspection and metrology module cluster tool
OwnerCory Watkinsinventor
Life of this patent
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Abstract
A semiconductor inspection tool includes a robot, a first wafer carrier proximate the robot, a first wafer inspection module proximate the robot, a second wafer inspection module proximate the robot, and a controller configured for controlling the robot to pass wafers between the first wafer carrier, the first wafer inspection module, and the second wafer inspection module.
Claims33
A semiconductor inspection tool comprising:
- a robot;
- a first wafer carrier proximate the robot;
- a first wafer inspection module proximate the robot;
- a second wafer inspection module proximate the robot;
- and
- a controller configured for controlling the robot to pass wafers between the first wafer carrier, the first wafer inspection module, and the second wafer inspection module.
3 more elements
A semiconductor inspection tool comprising:
- a handler including a robot;
- a wafer carrier module removably coupled to the handler;
- a first inspection module removably coupled to the handler;
- a second inspection module removably coupled to the handler;
- a controller electrically coupled to the robot, the controller configured to control the robot to pass wafers between the wafer carrier module, the first inspection module, and the second inspection module.
2 more elements
A method for inspecting a semiconductor wafer, the method comprising:
- providing an inspection tool comprising a handler including a robot, a first wafer carrier module removably coupled to the handler, a first wafer inspection module removably coupled to the handler, and a second wafer inspection module removably coupled to the handler;
- and
- controlling the robot with a controller to pass wafers between the first wafer carrier module, the first wafer inspection module, and the second wafer inspection module.
Dependencies are inferred from the claim text.