Singulation method used in leadless packaging process

A leadless semiconductor package comprising:

• a die pad;
• a semiconductor chip disposed on the die pad;
• a plurality of contacts arranged at the periphery of the die pad and electrically connected to the semiconductor chip;
• and
• a package body encapsulating the die pad, the semiconductor chip and the plurality of contacts while each contact having at least one surface exposed from the package body;
• wherein the surface of each contact has at least one cavity which is formed by an etching process.

An array of molded products, which is formed on a lead frame for making a plurality of leadless semiconductor packages, comprising:

• a plurality of product units each comprising a die pad, a semiconductor chip disposed on the die pad, a plurality of contacts arranged at the periphery of the die pad and electrically connected to the semiconductor chip, and a package body encapsulating the die pad, the semiconductor chip and the plurality of contacts;
• a plurality of dambars each being located between two adjacent product units, connecting the contacts of the two adjacent product units, and having an upper surface and a lower surface;
• wherein each dambar has at least one groove formed on one of the upper surface and the lower surface;
• and
• wherein the plurality of product units can be individually separated by etching away the dambars through a etching process so as to form the plurality of leadless semiconductor packages.

An array of molded products, which is formed on a lead frame for making leadless semiconductor packages, comprising:

• a plurality of product units each comprising a die pad, a semiconductor chip disposed on the die pad, a plurality of contacts arranged at the periphery of the die pad and electrically connected to the semiconductor chip, and a package body encapsulating the die pad, the semiconductor chip and the plurality of contacts;
• a plurality of dambars each being located between two, adjacent product units, connecting the contacts of the two adjacent product units, and having an upper surface and a lower surface;
• wherein each dambar has at least one through hole formed between the upper surface and the lower surface;
• and
• wherein the plurality of product units can be individually separated by etching away the dambars through a etching process so as to form the plurality of leadless semiconductor packages.