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US 2005/0037545 A1Published application
Flip chip on lead frame
AssigneeCarsem (M) Sdn. Bhd.
InventorsLily Khor, Au Yeun
Life of this patent
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Abstract
There is disclosed a flip-chip-type method of assembling semiconductor devices. A one-step encapsulation process promotes adhesion of the die to the lead fingers and prevents the potential of shorts developing between the adjacent bumps or lead fingers. Conventional mold compound is used to reduce localized stress caused by coefficient of thermal expansion (CTE) mismatch between the die and substrate, or the lead frame.
Claims5
A flip-chip-type method of attaching a semiconductor die to a lead frame, comprising the steps of:
- configuring said semiconductor die with a plurality of predetermined electric contact points so as to accommodate connection to lead fingers of said lead frame;
- configuring the discrete conductive elements over the predetermined electric contact points;
- and
- securing said semiconductor die to said lead frame by re-flowing said discrete conductive elements.
1 more element
Dependencies are inferred from the claim text.