Semiconductor packaging structure and method for forming the same
OwnerSzu Yu Laiinventor
Life of this patent
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Abstract
A semiconductor packaging structure comprises a die; at least one pad on the die; a least one elastomers on a corresponding one of the at least one pad, wherein the at least one elastomer is made of conductive or non-conductive material; a first conductor on the elastomer; a second conductor located on the first conductor. The second conductor is directly welded to a substrate. Thermal expansion between the substrate and the die is absorbed by the strain of the elastomer and the extension of the first conductor. Furthermore, a method for forming the semiconductor packaging structure is disclosed.
Claims7
A semiconductor packaging structure comprising:
- a die;
- at least one pad oh the die;
- a least one elastomer on a corresponding one of the at least one pad, wherein the at least one elastomer is made of conductive or non-conductive material;
- a first conductor on the elastomer;
- a second conductor being located on the first conductor;
- wherein the second conductor is directly welded to a substrate;
- wherein thermal expansion between the substrate and the die is absorbed by strain of the elastomer and extension of the first conductor.
A method for manufacturing a semiconductor packaging structure, comprising the steps of:
- coating a first metal layer on a surface of a passivation layer of a wafer;
- coating a first photo-resistor layer on the first metal layer;
- exposing and developing the first photo-resistor layer for removing undesired portions to form a plurality of photo-resistors;
- etching the first metal layer to form a plurality of pads below the photo-resistors;
- removing the photo-resistors to expose the plurality of pads;
- coating a second photo-resistor layer coated upon the passivation layer and the plurality of pads;
- exposing and developing the second photo-resistors on the pads so that the portions of the second photo-resistor layer on the pads are removed to form openings which have a size small than that of the pads;
- filling elastomers into the openings;
- removing other second photo-resistor layer;
- coating a layer of second metal layer on the wafer;
- coating a third photo-resistor layer on the second metal layer;
- exposing and developing the second photo-resistor layer for forming openings, which is corresponding to the third photo-resistors of the elastomers;
- etching the second metal layer for forming a plurality of first conductors on the elastomers;
- forming a passivation layer around a periphery of each first conductor;
- forming a second conductor formed on the first conductor.
Dependencies are inferred from the claim text.