Thin film transistor liquid crystal display and fabrication method thereof

A method of fabricating a thin film transistor-LCD, comprising:

• depositing a first metal layer on a transparent substrate;
• patterning the first metal layer to form at least two adjacent gate electrodes;
• forming a gate insulating layer on the gate electrodes;
• forming a semiconductor layer on the insulating layer;
• patterning the semiconductor layer into a predetermined shape;
• depositing a second metal layer on the transparent substrate;
• patterning the second metal layer to form a source/drain electrode layer;
• depositing an insulating layer on the transparent substrate;
• defining a contact hole via the insulating layer, source/drain electrode layer, and gate insulating layer, exposing a part of the surface of transparent substrate between the adjacent gate electrodes;
• depositing a transparent conductive layer on the transparent substrate;
• and
• forming a light-shielding matrix directly above the contact hole.

A method of fabricating a thin film transistor-LCD, comprising:

• depositing a first metal layer on a transparent substrate;
• patterning the first metal layer to form at least two adjacent gate electrodes by photolithography;
• forming a gate insulating layer on the gate electrodes;
• forming a semiconductor layer on the insulating layer;
• patterning the semiconductor layer into a predetermined shape by photolithography;
• depositing a second metal layer on the transparent substrate;
• patterning the second metal layer to form a source/drain electrode layer by photolithography;
• depositing an insulating layer on the transparent substrate;
• defining a contact hole by photolithography, separated from the gate electrodes, via the insulating layer, source/drain electrode layer, and gate insulating layer, exposing a part of the surface of transparent substrate between the adjacent gate electrodes;
• depositing an indium tin oxide layer on the transparent substrate;
• providing a color filter a predetermined distance above the transparent substrate, having a light-shielding matrix directly above the contact hole.