Heat-curable organopolysiloxane composition and adhesive

A heat-curable organopolysiloxane composition comprising:

• (A) a diorganopolysiloxane with both molecular chain terminals blocked with hydroxyl groups,
• (B) an organopolysiloxane resin comprising units represented by the formula:
• R13SiO1/2 (wherein each R1 independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms) and SiO2 units in a molar ratio of units represented by the formula:
• R13SiO1/2/SiO2 units of 0.6 to 1.7,
• (C) at least one compound selected from the group consisting of:
• (i) a compound having two or more allyloxycarbonyl groups (CH2═CHCH2O(CO)—),
• (ii) a compound represented by the general formula (1):
• wherein each of R2 and R3 independently represents an allyl group or a group represented by the general formula (2):
• —CH2CH2CH2—SiR4a(OR5)3-a (2)
• where each of R4 and R5 independently represents an unsubstituted or substituted monovalent hydrocarbon group, and a represents an integer from 0 to 2, and
• (iii) a compound represented by the general formula (3):
• wherein R4, R5, and a are as defined for the general formula (2), and
• (D) a curing agent.