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US 2005/0032384 A1Published application
Method of creating a photonic via using deposition
AssigneeIntel Corporation
InventorVenkatesan Murali
Life of this patent
Estimating the term…
Abstract
A photonic via is made in a substrate by making a hole in the substrate, depositing a cladding into the hole, and then depositing an optical core material into the hole. In one embodiment, a lens can be made by applying a polymer on top of the photonic via and curing.
Claims10
1-2. (Cancelled).
A method of making a photonic via comprising:
- making a hole in a substrate, wherein the hole extends from one side of the substrate through the substrate to an opposite side of the substrate, heating the substrate to expand the hole;
- inserting a fiber optic into the hole;
- cooling the substrate to contract the hole to hold the fiber optic in place;
- polishing the substrate;
- applying a polymer on top of the fiber optic;
- and
- curing the polymer to form a lens.
4 more elements
4-25. (cancelled).
(Cancelled).
A method of making a photonic via comprising:
- making a hole in a substrate, wherein the hole extends from one side of the substrate through the substrate to an opposite side of the substrate;
- heating the substrate to expand the hole;
- inserting a fiber optic into the hole,
- cooling the substrate to contract the hole to hold the fiber optic in place;
- polishing the substrate;
- and
- forming a waveguide having an angled surface to redirect light in a direction substantially perpendicular to the fiber optic, comprising:
- depositing a cladding layer on the substrate;
- depositing a layer of optical material over the cladding;
- depositing a mask on the optical material with an opening over the hole;
- and
- etching to form at least one angled surface in the optical material.
9 more elements
Dependencies are inferred from the claim text.