Lead frame, semiconductor device using the same and method of producing the semiconductor device
AssigneeNEC Electronics Corporation
InventorTakekazu Tanaka
Life of this patent
Estimating the term…
Abstract
A lead frame of the present invention includes a pair of base portions having a substantially flat bottom each. An island portion and electrode portions are partly connected to the tops of the base portions. The lead frame needs a minimum of production cost and promotes dense mounting of semiconductor devices to a circuit board.
Claims6
A method of producing a semiconductor device for causing a surface of a lead frame to partly appear on a bottom of said semiconductor device, said method comprising the steps of:
- mounting a semiconductor chip to an island portion included in said lead frame;
- connecting electrodes formed on a surface of said semiconductor chip and an electrode portion with bonding wires;
- sealing part of a top and part of a bottom of said lead frame, which include said island portion, said semiconductor chip, said electrode portion and said bonding wire, with seal resin;
- grinding an entire surface of said seal resin beneath said lead frame in parallel to the bottom of said lead frame;
- and
- causing part of the bottom of said lead frame to appear on a bottom of said seal resin.
A method of producing a semiconductor device for causing a surface of a lead frame to partly appear on a bottom of said semiconductor device, said method comprising the steps of:
- mounting a semiconductor chip to an island portion included in said lead frame;
- connecting electrodes formed on a surface of said semiconductor chip and an electrode portion with bonding wires;
- sealing part of a top and part of a bottom of said lead frame, which include said island portion, said semiconductor chip, said electrode portion and said bonding wire, with seal resin;
- grinding an entire surface of said seal resin beneath said lead frame in parallel to the bottom of said lead frame;
- causing part of the bottom of said lead frame to appear on a bottom of said seal resin;
- half-cut dicing a bottom of said island portion;
- plating the bottom of said lead frame and the bottom of said island portion appeared on a bottom of said semiconductor device;
- and
- cutting a connecting portion, which forms part of a base portion of said lead frame, by half-cut dicing.
Dependencies are inferred from the claim text.