Assembly of device components and sub-systems
OwnerRenfeng Gao, Anthony Garito +1inventors
InventorsRenfeng Gao, Anthony Garito, Aydin Yeniay
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Abstract
An optical assembly has two mechanically matched substrates, each substrate including structures, such as circuits and circuit elements, that are in shapes complementary to the structures on the other substrate. At least one substrate includes a clipgate for at least one optical component.
Claims39
An optical assembly comprising:
- a first substrate comprising a first surface comprising at least a first structure and at least a first alignment feature;
- a second substrate comprising a first surface comprising at least a second structure complementary to each of the at least first structures and at least a second alignment feature complementary to each of the at least first alignment features;
- and
- a device mounted to at least one of the first surface of the first substrate and the first surface of the second substrates, the device selected from one of a photonic device, an electrical device, and a mechanical device.
An optical assembly according to 3, wherein the chip sub-mount further comprises at least one electrical device chosen from circuits and circuit elements.
An optical assembly comprising:
- a first substrate comprising a first surface comprising a first device;
- and
- a second substrate comprising a first surface comprising a first recess, wherein a surface geometry of the first recess of the second substrate is complementary to the first surface of the first substrate, and a second device, wherein contacting the first substrate to the second substrate permits the first surface of the first substrate to fit into the first recess of the second substrate and permits the first device to be aligned with the second device, and further wherein the first and second devices are chosen from photonic devices, electrical devices, and mechanical devices.
An optical assembly comprising:
- a first chip comprising a first surface comprising a first locator and a first device;
- a first chip sub-mount comprising a second surface comprising a second locator and a second device, wherein the first surface of the first chip fits into a recess in the second surface of the sub-mount when the first locator contacts the second locator.
A method of making an integrated optical assembly comprising:
- forming a first structure and a first alignment feature on a first substrate;
- forming a second structure and a second alignment feature on a second substrate, wherein the second structure and the second alignment feature are complementary in shape to the first structure and the first alignment feature, respectively, on the first substrate;
- positioning a first device on the first substrate;
- positioning a second device on the second substrate;
- and
- contacting the first alignment feature of the first substrate to the second alignment feature of the second substrate thereby permitting the first device on the first substrate to be aligned with the second device on the second substrate.
An optical assembly comprising:
- a first and a second mechanically matched substrates, each substrate comprising structures, wherein the structures on one substrate comprise shapes complementary to the structures on the other substrate, wherein at least one substrate comprises one or more clipgates for an optical component.
A method of making an integrated optical assembly, said method comprising:
- (a) fabricating structures on a first substrate;
- (b) fabricating structures on a second substrate in shapes complementary to the structures on the first substrate, wherein at least one of said first and second substrates comprise a clipgate for an optical component;
- (c) mechanically positioning an optical component in said clipgate;
- (d) bringing said first and second substrates into face-to-face configuration such that the complementary shaped structures are aligned;
- (e) physically contacting said first and second substrates;
- and
- (f pressing the said first and second substrates together.
Dependencies are inferred from the claim text.