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US 2005/0029675 A1Published application
Tin/indium lead-free solders for low stress chip attachment
OwnerFay Huainventor
Life of this patent
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Abstract
Some embodiments of the present invention include lead-free solders for use in low stress component attachments.
Claims27
An apparatus comprising:
- a plurality of conductive contacts on at least one surface of a die;
- and
- a substrate conductively coupled to at least one of the conductive contacts by a solder comprising tin and indium.
A method comprising:
- heating a die and a substrate, the die including a plurality of conductive contacts on at least one surface thereof and the substrate including a plurality of solder bumps comprising tin and indium on at least one surface thereof, to a temperature above the melting point of the solder bumps;
- contacting at least one of the conductive contacts with at least one of the solder bumps;
- and
- cooling the die and the substrate to form at least one connection.
1 more element
An alloy comprising:
- about 82 to 88 weight percent tin;
- and
- about 12 to 18 weight percent indium.
An apparatus comprising:
- a first component attached to a second component by a solder comprising tin and indium small grain microstructure.
Dependencies are inferred from the claim text.