Multi-chip semiconductor device with specific chip arrangement
AssigneeHitachi, Ltd.
InventorsYasuhiro Naka, Naotaka Tanaka, Ikuo Yoshida, Satoshi Imasu, Takahiro Naito
Life of this patent
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Abstract
In a multi-chip-module type semiconductor device, first and second semiconductor elements, a main component of each of the semiconductor elements being semiconductor material to form a semiconductor electric circuit in each of the semiconductor elements, are mounted on and electrically connected to a substrate adapted to be mounted onto a mother board and to be electrically connected to the mother board so that the each of the semiconductor elements is electrically connected to the mother board through the substrate.
Claims14
1-19. (Canceled)
A multi-chip-module type semiconductor device comprising:
- first and second semiconductor elements, a main component of each of the semiconductor elements being semiconductor material to form a semiconductor electric circuit;
- and
- a substrate adapted to be mounted onto a motherboard and to be electrically connected to the motherboard, to which the first and second semiconductor elements are electrically connected.
Dependencies are inferred from the claim text.