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US 2005/0029660 A1Published application
Adhesions of structures formed from materials of poor adhesion
AssigneeInfineon Technologies AG
InventorsEike Ruttkowski, Franz Hofmann, Bjorn-Oliver Eversmann
Life of this patent
Estimating the term…
Abstract
Semiconductor device having a substrate, at least one adhesion promoter core, which is deposited on a part of the substrate, and a deposit, which completely surrounds the adhesion promoter core, of a material of poor adhesion which is different than the adhesion promoter material and is in direct contact with the substrate, as well as methods-for the production thereof.
Claims19
An electronic device, comprising:
- a substrate;
- at least one adhesion promoter core, which is deposited on a part of the substrate;
- and
- a deposit, which completely surrounds the adhesion promoter core, of a material of poor adhesion which is different than a material of the adhesion promoter core and is in direct contact with the substrate.
1 more element
An electronic device, comprising:
- a substrate;
- at least one adhesion promoter core, which is deposited on a part of the substrate;
- a deposit arranged on side faces of the at least one promoter core, of a material of poor adhesion which is different than the adhesion promoter material and is in direct contact with the substrate;
- and
- a layer, formed from a reaction product of the adhesion promoter material on that side of the adhesion promoter core which is remote from the substrate, so that the layer formed from a reaction product of a material of the adhesion promoter core and the deposit of the material of poor adhesion completely surrounds the adhesion promoter core arranged on the substrate.
2 more elements
Dependencies are inferred from the claim text.