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US 2005/0029645 A1Published application
Stacked mass storage flash memory package
AssigneeMicron Technology, Inc.
InventorsLeonard Mess, Jerry Brooks, David Corisis
Life of this patent
Estimating the term…
Abstract
A stacked multiple offset chip device is formed of two or more dice of similar dimensions and bond pad arrangement, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a maximum density low profile device. A particularly useful application is the formation of stacked mass storage flash memory package.
Claims111
A stacked semiconductor die device, comprising:
- a substrate having a surface;
- at least one conductive bond area on the surface of the substrate;
- a plurality of semiconductor dice having similar shapes, each semiconductor die having an active surface including at least four edges, and a back side;
- a field of conductive bond pads disposed on the active surface of each semiconductor die, the field of conductive bond pads positioned along less than three edges of the active surface of a semiconductor die, the back side of a first semiconductor die being attached to the surface of the substrate adjacent the at least one conductive bond area of the surface of the substrate and the back side of a second semiconductor die is attached to the active surface of the first semiconductor die in an offset position having the field of conductive bond pads of the first semiconductor die exposed;
- conductors connecting bond pads of the first semiconductor die to the at least one conductive bond area of the substrate;
- and
- conductors connecting bond pads of the second semiconductor die to the conductive bond areas of the substrate.
4 more elements
A stacked multiple-die device, comprising:
- a substrate having a surface;
- conductive bond areas on the surface of the substrate;
- a plurality of semiconductor dice having substantially same shapes, each semiconductor die having a rectangular active surface having at least four edges, and a back side;
- a field of conductive bond pads disposed on the active surface of each semiconductor die, the field positioned along less than three edges thereof, the back side of a first semiconductor die being attached to the surface of the substrate adjacent the conductive bond areas of the surface of the substrate, the back side of a second semiconductor die being attached to the active surface of the first semiconductor die in an offset position having the field of conductive bond pads of the first semiconductor die exposed;
- conductors connecting bond pads of the first semiconductor die to the conductive bond areas of the substrate;
- and
- conductors connecting bond pads of the second semiconductor die to the conductive bond areas of the substrate.
4 more elements
A stacked multiple-semiconductor die device, comprising:
- a substrate having a surface;
- at least one conductive bond area on the surface of the substrate;
- a plurality of semiconductor dice, each semiconductor die having one of similar dimensions, different dimensions, and different bond pad arrangements, each semiconductor die having an active surface including at least four edges, and a back side;
- a field of conductive bond pads disposed on the active surface of each semiconductor die, the field of conductive bond pads positioned along less than three edges of the active surface of at least one semiconductor die, the back side of a first semiconductor die being attached to the surface of the substrate adjacent the at least one conductive bond areas of the surface of the substrate and the back side of a second semiconductor die is attached to the active surface of the first semiconductor die in an offset position having the field of conductive bond pads of the first semiconductor die exposed;
- conductors connecting bond pads of the first semiconductor die to the at least one conductive bond area of the substrate;
- and
- conductors connecting bond pads of the second semiconductor die to the at least one conductive bond area of the substrate.
4 more elements
A high density stacked multiple-die device, comprising:
- a substrate having a surface;
- conductive bond areas on the surface of the substrate;
- a plurality of semiconductor dice having substantially different shapes, each semiconductor die having a rectangular active surface having at least four edges, and a back side;
- a field of conductive bond pads disposed on the active surface of each semiconductor die, the field of conductive bond pads positioned along less than three edges thereof, the back side of a first semiconductor die being attached to the surface of the substrate adjacent the conductive bond areas of the surface of the substrate, the back side of a second semiconductor die being attached to the active surface of the first semiconductor die in an offset position having the field of conductive bond pads of the first semiconductor die exposed;
- conductors connecting bond pads of the first semiconductor die to the conductive bond areas of the substrate;
- and
- conductors connecting bond pads of the second semiconductor die to the conductive bond areas of the substrate.
4 more elements
A stacked multiple-semiconductor die device, comprising:
- a substrate having a surface;
- at least one conductive bond area on the surface of the substrate;
- a plurality of semiconductor dice having similar dimensions, each semiconductor die having a active surface including at least four edges, and a backside;
- a field of conductive bond pads disposed on the active surface of each semiconductor die, the field of conductive pads positioned along less than three edges of the active surface of the semiconductor die, the backside of a first semiconductor die being attached to the substrate surface adjacent the conductive bond areas of said substrate surface and the backside of a second semiconductor die is attached to the active surface of the first semiconductor die in an offset position having the bond pad field of the first semiconductor die being exposed;
- conductors connecting bond pads of the first semiconductor die to conductive bond areas of the substrate;
- and
- conductors connecting bond pads of the second semiconductor die to one of conductive bond areas of the substrate and conductive bond pads of the first semiconductor die.
4 more elements
A method for forming a stacked multiple-semiconductor die device, comprising:
- providing a substrate having a surface and at least one conductive bond area on the surface of the substrate;
- providing a plurality of semiconductor dice having similar dimensions, each semiconductor die having a active surface including at least four edges, and a backside, and a field of conductive bond pads disposed on the active surface of each semiconductor die, the field of conductive pads positioned along less than three edges of the active surface of the semiconductor die;
- attaching the backside of a first semiconductor die to the substrate surface adjacent the conductive bond areas of said substrate surface and the backside of a second semiconductor die is attached to the active surface of the first semiconductor die in an offset position having the bond pad field of the first semiconductor die being exposed;
- forming conductors connecting bond pads of the first semiconductor die to conductive bond areas of the substrate;
- and
- forming conductors connecting bond pads of the second semiconductor die to one of conductive bond areas of the substrate and conductive bond pads of the first semiconductor die.
3 more elements
A method of making a multiple die stacked device, comprising:
- stacking a plurality of semiconductor dice in a stack on a substrate having conductive areas thereon, said stacking comprising:
- attaching a first semiconductor die to the substrate;
- and
- attaching subsequent semiconductor dice thereto to form said stack, the semiconductor die of the plurality of semiconductor dice in said stack being similar in shape;
- and
- offsetting the physical orientation of each of said second and subsequent semiconductor die in at least one direction from its underlying semiconductor die and is rotated in one of 0, 90, 180 and 270 degrees relative to said underlying semiconductor die to expose bond pads of the underlying semiconductor die while minimizing the size of the device.
3 more elements
A method of making a high density stacked multiple-die device, comprising:
- providing a substrate having a surface and conductive bond areas thereon;
- providing a plurality of semiconductor dice having substantially the same shape, each semiconductor die having a rectangular active surface having at least four edges, a backside, and a field of conductive bond pads disposed on the active surface of each semiconductor die;
- attaching the first semiconductor die to the substrate surface adjacent the conductive bond areas of said substrate surface having the field positioned along less than three edges thereof;
- attaching the backside of a second semiconductor die to the active surface of the first semiconductor die in an offset position having the bond pad field of the first die is exposed;
- forming conductors connecting bond pads of the first semiconductor die to conductive bond areas of the substrate;
- and
- forming conductors connecting bond pads of the second semiconductor die to one of conductive bond areas of the substrate and conductive bond pads of the first semiconductor die.
4 more elements
A method of making a high density multiple die stacked device, comprising:
- stacking a plurality of semiconductor dice attached in a stack on a substrate having conductive areas thereon, said stacking comprising:
- attaching a first semiconductor die to the substrate;
- stacking subsequent dice to the first semiconductor die forming a stack, the semiconductor dice in said stack being similar;
- orienting each of said second semiconductor die and subsequent semiconductor dice by offsetting each of said second semiconductor die and subsequent semiconductor dice in at least one direction from its underlying semiconductor die and rotated in one of 0, 90, 180 and 270 degrees relative to said underlying semiconductor die;
- and
- exposing bond pads of the underlying semiconductor die while minimizing the size of the device.
3 more elements
A method of making a multiple-semiconductor die device, comprising:
- providing a substrate having a surface and at least one conductive bond area on the surface of the substrate;
- providing a plurality of semiconductor dice, each semiconductor die having one of similar dimensions and different dimensions, each semiconductor die having a active surface including at least four edges, a backside, and a field of conductive bond pads disposed on the active surface of each semiconductor die, the field of conductive pads positioned along less than three edges of the active surface of the semiconductor die;
- attaching the backside of a first semiconductor die to the substrate surface adjacent the conductive bond areas of said substrate surface;
- attaching the backside of a second semiconductor die to the active surface of the first semiconductor die in an offset position having the bond pad field of the first semiconductor die being exposed;
- forming conductors connecting bond pads of the first semiconductor die to conductive bond areas of the substrate;
- and
- forming conductors connecting bond pads of the second semiconductor die to one of conductive bond areas of the substrate and conductive bond pads of the first semiconductor die.
4 more elements
A method of making a high density multiple die stacked device, comprising:
- providing a substrate having conductive areas thereon;
- and
- forming a stack a plurality of semiconductor dice in a stack on the substrate by attaching a first semiconductor die to the substrate and subsequent dice attached thereto, the semiconductor dice in said stack having at least two different sizes of semiconductor die;
- and offsetting each of said second semiconductor die and subsequent semiconductor dice being in at least one direction from its underlying semiconductor die while being rotated in one of 0, 90, 180 and 270 degrees relative to said underlying semiconductor die exposing bond pads of the underlying semiconductor die while minimizing the size of the device.
1 more element
A method of making a high density multiple die stacked device, comprising:
- attaching a plurality of semiconductor dice in a stack on a substrate having conductive areas thereon, said stack comprising a first semiconductor die attached to the substrate and subsequent dice attached thereto forming said stack, the semiconductor dice in said stack having at least two different sizes of semiconductor die, the size of the semiconductor die on the bottom of the stack having at least one dimension of one of length, width, and thickness which is larger than a corresponding dimension of at least another semiconductor die in the stack, and the physical orientation of each of said second semiconductor die and subsequent semiconductor dice being offset in at least one direction from its underlying semiconductor die and rotated in one of 0, 90, 180 and 270 degrees relative to said underlying semiconductor die exposing bond pads of the underlying semiconductor die while minimizing the size of the device.
Dependencies are inferred from the claim text.