Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

A method of manufacturing a film substrate, comprising:

• preparing an insulative sheet including a first region to be separated, and on which a semiconductor device chip is to be mounted;
• forming a slit on an outer peripheral line of the first region of the insulative sheet;
• and
• forming a conductive pattern crossing the slit and to be connected to an external terminal of the semiconductor device chip, on the insulative sheet.

A method of manufacturing a semiconductor device, comprising:

• preparing an insulative sheet including a first region to be separated;
• forming a slit on an outer peripheral line of the first region of the insulative sheet;
• forming a conductive pattern crossing the slit, on the insulative sheet;
• and
• mounting a semiconductor device chip on the insulative sheet to electrically connect an external terminal of the semiconductor device chip to the conductive pattern.

A method of manufacturing a circuit board with a semiconductor device, comprising:

• preparing an insulative sheet including a first region to be separated and a second region on the outer side of the first region;
• forming a slit on an outer peripheral line of the first region of the insulative sheet;
• forming a conductive pattern crossing the slit, on the insulative sheet;
• mounting a semiconductor device chip on the insulative sheet to electrically connect an external terminal of the semiconductor device chip to the conductive pattern;
• bonding at least a part of the first region of the insulative sheet on which the semiconductor device chip is mounted to a circuit board;
• and
• separating the second region from the first region to leave the first region on the circuit board.