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US 2005/0029633 A1Published application
Optical semiconductor device and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorMasaru Yumura
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Abstract
An optical semiconductor device comprises a lead frame, a mount bed integrated with the lead frame, an optical semiconductor element mounted on the mount bed with an adhesive agent interposed therebetween, and a light-transmitting resin for sealing the optical semiconductor element. A surface of the mount bed mounting the optical semiconductor element has a concave portion and has one end of a discharge hole penetrating the mount bed in the concave portion.
Claims9
An optical semiconductor device comprising:
- a lead frame;
- a mount bed integrated with the lead frame;
- an optical semiconductor element mounted on the mount bed with an adhesive agent interposed therebetween;
- and
- a light-transmitting resin for sealing the optical semiconductor element,
- wherein a surface of the mount bed mounting the optical semiconductor element has a concave portion and has one end of a discharge hole penetrating the mount bed in the concave portion.
3 more elements
A method for manufacturing an optical semiconductor device, comprising:
- integrally forming a lead frame having a predetermined shape and a mount bed by injection molding;
- forming a discharge hole penetrating the mount bed at a predetermined position;
- forming a concave portion on an upper surface of the mount bed including one end of the discharge hole;
- applying an adhesive agent onto the upper surface of the mount bed including the concave portion;
- mounting an optical semiconductor element on the adhesive agent;
- and
- sealing the optical semiconductor element with a light-transmitting resin and heat curing the resin.
4 more elements
Dependencies are inferred from the claim text.