Substrate for electronic device, electronic device and methods of manufacturing same
AssigneeTDK Corporation
InventorsTakao Noguchi, Hisatoshi Saitou, Hidenori Abe
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Abstract
A substrate for an electronic device comprises a base, an adhesion film stacked on the base, and a conductor film stacked on the adhesion film. The adhesion film is a non-epitaxial film including a crystal having a wurtzite crystal structure. The electronic device comprises the substrate and a functional film having a specific function and disposed on the substrate.
Claims17
A substrate for an electronic device comprising:
- a base;
- an adhesion film stacked on the base;
- and
- a conductor film stacked on the adhesion film, wherein
- the adhesion film is a non-epitaxial film including a crystal having a wurtzite crystal structure.
A method of manufacturing a substrate for an electronic device, the substrate comprising a base, and an adhesion film and a conductor film that are stacked on the base one by one, the method comprising the steps of:
- forming the adhesion film on the base;
- and
- forming the conductor film on the adhesion film, wherein
- the adhesion film is a non-epitaxial film including a crystal having a wurtzite crystal structure.
An electronic device comprising a substrate for the electronic device and a functional film having a specific function and disposed on the substrate, the substrate incorporating:
- a base;
- an adhesion film stacked on the base;
- and
- a conductor film stacked on the adhesion film, wherein
- the adhesion film is a non-epitaxial film including a crystal having a wurtzite crystal structure.
A method of manufacturing an electronic device comprising a substrate for the electronic device and a functional film having a specific function and disposed on the substrate, the method comprising the steps of:
- fabricating the substrate;
- and
- forming the functional film on the substrate, wherein:
- the step of fabricating the substrate includes the steps of:
- forming an adhesion film on a base;
- and
- forming a conductor film on the adhesion film, wherein
- the adhesion film is a non-epitaxial film including a crystal having a wurtzite crystal structure.
Dependencies are inferred from the claim text.