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US 2005/0029554 A1Published application
Molded ball grid array
OwnerWilliam Stephenson, Bret Street +1inventors
InventorsWilliam Stephenson, Bret Street, Todd Bolken
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Abstract
A BGA and a system implementing a BGA. Specifically, a BGA package is encapsulated after the balls are attached to the package. The backside of the package having the balls disposed thereon may be completely covered by the encapsulant. The encapsulant is disposed in direct contact about a portion of the balls. A liner is provided to facilitate the formation of an unencapsulated portion of each ball. The unencapsulated portion may be used to couple the package to a system.
Claims20
A molded ball grid array comprising:
- a substrate having a first surface and a second surface;
- a plurality of conductive balls coupled to the first surface of the substrate;
- a semiconductor device coupled to the second surface of the substrate;
- and
- an encapsulant disposed over the first surface of the substrate and disposed conformally about the conductive balls, wherein the encapsulant conforms to the shape of the plurality of conductive balls and covers only a portion of the surface area of the plurality of conductive balls.
2 more elements
A system comprising:
- a processor;
- and
- a package operatively coupled to the processor, wherein the package comprises:
- a substrate having a first surface and a second surface;
- a plurality of conductive balls coupled to the first surface of the substrate;
- a semiconductor device coupled to the second surface of the substrate;
- and
- an encapsulant disposed over the first surface of the substrate and disposed conformally about the conductive balls, wherein the encapsulant conforms to the shape of the plurality of conductive balls and covers a portion of the surface area of the plurality of conductive balls.
5 more elements
Dependencies are inferred from the claim text.