Method of effecting heating and cooling in reduced pressure atmosphere

A heating/cooling method comprising the steps of:

• heating a plate-like member placed in a reduced pressure atmosphere in a chamber by heating means opposed to the plate-like member;
• and
• cooling the plate-like member by a cooling plate which is opposed to the plate-like member, with the heating means therebetween, the cooling plate having a heat reflecting function,
• wherein the cooling plate has a emissivity that is a value which minimizes a sum of a requisite time for the heating step and a requisite time for the cooling step.

A method of manufacturing an image display apparatus having a container formed by using a substrate having two main surfaces opposite to each other, the method comprising the steps of:

• heating the substrate placed in a reduced pressure atmosphere in a chamber by heating means opposed to the substrate;
• and
• cooling the substrate by a cooling plate which is opposed to the substrate, with the heating means therebetween, the cooling plate having a heat reflecting function,
• wherein the cooling plate has a emissivity of not less than 0.50 but not more than 0.80.

A method of manufacturing an image display apparatus having a container formed by using a substrate which has two main surfaces opposite to each other, the substrate having an accessory, whose heat capacity is different from that of the substrate, provided on one of the two main surfaces thereof, the method comprising the steps of:

• heating the substrate placed in a reduced pressure atmosphere in a chamber by heating means opposed to the substrate;
• and
• cooling the substrate by a cooling plate which is opposed to the substrate, with the heating means therebetween, the cooling plate having a heat reflecting function,
• wherein the heating means is opposed to the other of the two main surfaces of the substrate.

A method of manufacturing an image display apparatus having a container formed by using a substrate which has two main surfaces opposite to each other, the two main surfaces differing from each other in an in-plane distribution of emissivity, the method comprising the steps of:

• heating the substrate placed in a reduced pressure atmosphere in a chamber by heating means opposed to the substrate;
• and
• cooling the substrate by a cooling plate which is opposed to the substrate, with the heating means therebetween, the cooling plate having a heat reflecting function,
• wherein the heating means is opposed to one of the two main surfaces of the substrate which has a smaller distribution of emissivity.