Method for scribing substrate of brittle material and scriber
AssigneeMitsuboshi Diamond Industrial Co., Ltd.
InventorsMasato Matsumoto, Tougo Gonoe
Life of this patent
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Abstract
A mother glass substrate is continuously heated by a first laser spot LS1 to a temperature which is lower than a softening point of the mother glass substrate, along a scribe line formation line SL on a surface of the mother glass substrate, along which a scribe line is to be formed, while an area close to the first laser spot LS1 is continuously cooled along the scribe line formation line SL; and an area which is close to the cooled area and is on an opposite side to the first laser spot LS1 is continuously heated by a second laser spot LS2 along the scribe line formation line SL to a temperature which is lower than the softening point of the mother glass substrate.
Claims12
A scribing method for a brittle material substrate, wherein the brittle material substrate is continuously heated by a first laser spot to a temperature which is lower than a softening point of the brittle material substrate, along a scribe line formation line on a surface of the brittle material substrate, along which a scribe line is to be formed, while an area close to the first laser spot is continuously cooled along the scribe line formation line;
- and an area which is close to the cooled area and is on an opposite side to the first laser spot is continuously heated by a second laser spot along the scribe line formation line to a temperature which is lower than the softening point of the brittle material substrate.
A scribing apparatus for a brittle material substrate, opposite side to the first laser spot is continuously heated by a second laser spot along the scribe line formation line to a temperature which is lower than the softening point of the brittle material substrate,
- wherein both sides of the scribe line formation line at an edge portion of the brittle material substrate are preheated while being heated by the first laser spot simultaneously.
A scribing method for a brittle material substrate, wherein the brittle material substrate is continuously heated by a first laser spot to a temperature which is lower than a softening point of the brittle material substrate, along a scribe line formation line on a surface of the brittle material substrate, along which a scribe line is to be formed, while an area close to the first laser spot is continuously cooled along the scribe line formation line;
- and an area which is close to the cooled area and is on an opposite side to the first laser spot is continuously heated by a second laser spot along the scribe line formation line to a temperature which is lower than the softening point of the brittle material substrate,
- wherein the cooled area is extended longer along the scribe line formation line.
A scribing apparatus for a brittle material substrate, comprising:
- heating means for continuously irradiating the brittle material substrate having a scribe line formation line, along which a scribe line is to be formed, with a first laser beam so as to form a first laser spot, and heating the brittle material substrate to a temperature which is lower than a softening point of the brittle material substrate;
- cooling means for continuously cooling an area close to an area heated by the first laser spot along the scribe line formation line;
- and
- heating means for continuously irradiating an area which is close to the cooled area and is on an opposite side to the first laser spot with a second laser beam along the scribe line formation line so as to form a second laser spot, and heating the brittle material substrate to a temperature which is lower than the softening point of the brittle material substrate,
- wherein a vertical crack is formed along the scribe line formation line,
- the scribing apparatus comprising preheating means for irradiating the brittle material substrate with a third laser beam so as to form a pair of preheated spots on both sides of the scribe line formation line of the brittle material substrate.
A scribing apparatus for a brittle material substrate, comprising;
- heating means for continuously irradiating the brittle material substrate having a scribe line formation line, along which a scribe line is to be formed, with a first laser beam so as to form a first laser spot along the scribe line formation line, and heating the brittle material substrate to a temperature which is lower than a softening point of the brittle material substrate;
- cooling means for continuously cooling an area close to an area heated by the first laser spot along the scribe line formation line;
- and
- heating means for continuously irradiating an area which is close to the cooled area and is on an opposite side to the first laser spot with a second laser beam along the scribe line formation line so as to form a second laser spot, and heating the brittle material substrate to a temperature which is lower than the softening point of the brittle material substrate,
- wherein a vertical crack is formed along the scribe line formation line,
- wherein the cooling means has a structure for spraying a cooling medium such that cooling medium forms a rectangular shape along the scribe line formation line.
A scribing apparatus for a brittle material substrate, comprising:
- heating means for continuously irradiating the brittle material substrate having a scribe line formation line, along which a scribe line is to be formed, with a first laser beam so as to form a first laser spot along the scribe line formation line, and heating the brittle material substrate to a temperature which is lower than a softening point of the brittle material substrate;
- cooling means for continuously cooling an area close to an area heated by the first laser spot along the scribe line formation line;
- and
- heating means for continuously irradiating an area which is close to the cooled area and is on an opposite side to the first laser spot with a second laser beam along the scribe line formation line so as to form a second laser spot, and heating the brittle material substrate to a temperature which is lower than the softening point of the brittle material substrate,
- wherein a vertical crack is formed along the scribe line formation line,
- wherein the cooling means has a plurality of cooling nozzles arranged along the scribe line formation line, and each cooling nozzle sprays a cooling medium such that the cooling medium forms a circular area.
Dependencies are inferred from the claim text.