Back to results
US 2004/0205281 A1Published application
Front side bus module
OwnerWen-Yen Lin, Tsan-Nan Chien +2inventors
InventorsWen-Yen Lin, Tsan-Nan Chien, Yu Liu, Chih-Ming Liu
Life of this patent
Estimating the term…
Abstract
A front side bus module is disclosed. The front side bus module includes a high density interconnection substrate and a plurality of high speed devices, wherein the high speed devices are disposed on the high density interconnection substrate and electrically connected therethrough.
Claims21
A front side bus module, comprising:
- a high density interconnection (HDI) substrate;
- and
- a plurality of high speed devices disposed on the high density interconnection substrate and electrically connected.
A motherboard, comprising:
- a main circuit board;
- a front side bus module electrically connected to the main circuit board;
- and
- an electromagnetic interference (EMI) shield covering the front side bus module.
1 more element
Dependencies are inferred from the claim text.