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AssigneeKYOCERA Corporation
InventorsMasafumi Horiuchi, Katsuro Nakamata, Hiroshi Ninomiya, Yasuhiko Fukuoka, Satoru Iwasaki, Kenta Fukuyama
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A high-frequency module comprises: a diplexer connected to an antenna terminal for branching a plurality of transmission/reception systems different in pass band from one another; switch circuits for switching the transmission/reception systems to transmission systems and reception systems; power amplifiers for amplifying transmission signals in the pass bands of the transmission systems; and matching circuits for matching the impedances of the power amplifiers to one another. The power amplifiers and the switch circuits are respectively formed by high-frequency semiconductor integrated circuit elements, and these high-frequency semiconductor integrated circuit elements are mounted on the surface of the multi-layer substrate. The high-frequency module is reduced both in size and loss and increased in isolation in its entirety.
A high-frequency module comprising:
A high-frequency module according to claim 7, wherein at least one low-pass filter is disposed in the signal passages from the antenna terminal to the switch circuits.
18 A high-frequency module according to claim 1, wherein each of conductor layers formed on the dielectric layers forming the multi-layer substrate, is a conductor of which chief ingredient is selected from the group consisting of Ag (silver), Cu (copper), and Au (gold).
Dependencies are inferred from the claim text.