Chemical mechanical polishing apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Won Lee, Chang-Ki Hong, Ho-Young Kim
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Abstract
A chemical mechanical polishing (CMP) apparatus includes a plate that holds a substrate, a pad assembly unit comprising a pad support device, a positioning device, and a rotation device operatively connected to the pad assembly unit. The pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached. The positioning device can move at least one of the plurality of support plates in a direction along a surface of the semiconductor substrate to be polished. Further, the CMP apparatus can control the polishing amount along any portion of a surface of a wafer to be polished.
Claims23
A chemical mechanical polishing (CMP) apparatus, comprising:
- a plate that holds a substrate;
- a pad assembly unit comprising a pad support device and a positioning device, wherein the pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached, and wherein the positioning device can move at least one of the plurality of support plates in a direction along a surface of a substrate to be polished;
- and
- a rotation device operatively connected to the pad assembly unit.
A chemical mechanical polishing (CMP) apparatus, comprising:
- a plate that holds a substrate;
- a pad assembly unit comprising a pad support device and a positioning device, wherein the pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached, and wherein the positioning device comprises a housing, a plurality of motors attached to the housing, a plurality of screws rotatably attached to the housing, and wherein each screw is coupled to a corresponding motor, and a plurality of connecting rods each having a screw groove, wherein each connecting rod is coupled to a corresponding support plate and to a corresponding screw through the screw groove;
- and
- a rotation device operatively connected to the pad assembly unit.
A pad assembly unit for a chemical mechanical polishing (CMP) apparatus, the pad assembly unit comprising:
- a pad support device comprising a plurality of support plates to which pad pieces of a polishing pad can be attached;
- and
- a positioning device that can move at least one of the plurality of support plates in a direction along a surface of a substrate to be polished.
Dependencies are inferred from the claim text.