Helical microelectronic contact and method for fabricating same

(Cancelled)

The method of claim 21, wherein the providing step further comprises:

• forming a tapered pad on a sacrificial substrate;
• transferring the tapered pad to the device substrate.

The method of claim 21, wherein the patterning a trace step further comprises depositing a metallic material by a method selected from chemical vapor deposition, physical vapor deposition, and sputtering.

(Cancelled)

The method of claim 17, wherein the etching a pit step further comprises etching a pit having a shape selected from pyramidal, truncated pyramidal, stepped pyramidal, conical, hemispherical, prism-shaped, and truncated prism-shaped.

The method for making a microelectronic contact comprising:

• providing a tapered pad by etching a pit in a sacrificial substrate and filling the pit with a liquid elastomer material, the tapered pad comprising a base adhered to a device substrate, side surfaces extending away from the device substrate and tapering to a end area distal from the device substrate;
• and
• patterning a trace from a terminal of said substrate in a coiled pattern over the tapered pad to the end area, thereby defining a helix.

A method for making a microelectronic contact comprising:

• providing a tapered pad comprised of an elastomer material, the tapered pad comprising a base adhered to a device substrate, side surfaces extending away from the device substrate and tapering to a end area distal from the device substrate;
• and
• patterning a trace from a terminal of said substrate in a coiled pattern over the tapered pad to the end area, thereby defining a helix.

(Cancelled)

A method for making a microelectronic contact comprising:

• providing a tapered pad comprising a base adhered to a device substrate, side surfaces extending away from the device substrate and tapering to a end area distal from the device substrate;
• and
• patterning a trace having a coiled portion and a straight portion, the coil portion patterned over the tapered pad from a terminal of said substrate forming a coiled pattern to the end area, and the straight portion patterned over the substrate from the terminal to an area separate from the tapered pad.