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US 2004/0203261 A1Published application
Electronic assembly having angled spring portions
AssigneeIntel Corporation
InventorsBrian L. DeFord, Donald T. Tran
Life of this patent
Estimating the term…
Abstract
An electronic assembly is provided, having a plurality of spring elements interconnecting corresponding terminals of first and second arrays of terminals on first and second electronic devices. The arrays have rows and columns extending in x- and y-directions, respectively. Each spring element has a cantilever portion extending diagonally in the x- and y-directions between corresponding terminals of the first and second arrays.
Claims17
An electronic assembly, comprising:
- first and second electronic devices;
- first and second arrays of terminals in rows, extending in an x-direction, and columns, extending in a y-direction, on facing sides of the first and second electronic devices respectively, terminals of the second array being offset in the x- and y-directions relative to terminals of the first array;
- and
- a plurality of spring elements interconnecting corresponding terminals of the first and second arrays, each having a cantilever portion extending diagonally in the x- and y-directions between corresponding terminals of the first and second arrays.
1 more element
An electronic assembly, comprising:
- a circuit board;
- a socket body on the circuit board;
- a first array of terminals on the socket body;
- a package substrate;
- a second array of terminals on a side of the package substrate facing the socket body, the terminals of the first and second arrays being located in rows, extending in an x-direction, and columns, extending in a y-direction, terminals of the second array being offset in the x- and y-directions relative to terminals of the first array;
- a plurality of spring elements secured to the first array of terminals and interconnecting corresponding terminals of the first and second arrays, each having a cantilever portion extending diagonally in the x- and y-directions between corresponding terminals of the first and second arrays;
- and
- a microelectronic die mounted to the package substrate.
5 more elements
A socket, comprising:
- a socket body;
- an array of terminals on the socket body, in rows extending in an x-direction and columns extending in a y-direction;
- and
- a plurality of spring elements secured to respective ones of the terminals, each spring element having a cantilever portion extending diagonally in the x- and y-directions from the respective terminal to which the respective spring element is secured.
1 more element
Dependencies are inferred from the claim text.