Heat dissipation unit with direct contact heat pipe
AssigneeThermal Corp.
InventorScott Garner
Life of this patent
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Abstract
A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross-section and can snap-fit in openings through the fins. The tube is exposed on one side of the heat sink for contact with the heat generating circuit. The fins can be flat or irregular and can have a collar engaging the heat pipe tube. In one example, the heat pipe runs perpendicular to vertical fins along the bottom of a standing fin stack. In another embodiment two U-shaped heat pipe tubes carry a layered stack, the bottom of the U-shapes being presented under the lowermost in the stack. A clamp urges the heat sink against the heat source.
Claims10
A method for forming a heat transfer device for dissipating heat comprising the steps of:
- arranging a plurality of fins that are formed with openings that substantially align with one another so as to define a die;
- driving a heat pipe comprising a thermally conductive envelope into said die so as to deform said envelope thereby forming at least one flattened surface and wherein an outside shape of said thermally conductive envelope is complementary with said openings;
- and
- supporting said fins upon said thermally conductive envelope such that said thermally conductive envelope substantially defines a mounting base for said heat transfer device, and is attachable to a heat source for thermal energy exchange with said heat source.
The heat transfer device formed by the method of claim 12 wherein said thermally conductive envelope is deformed by said fins.
Dependencies are inferred from the claim text.