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AssigneeLittelfuse, Inc.
InventorsEdwin James Harris, Tushar Vyas, Stephen J. Whitney
Estimating the term…
A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.
1 A composition for providing protection against electrical overstress comprising:
The composition of claim 1, wherein the insulating binder includes a polymer resin.
The composition of claim 1, wherein the doped core includes silicon and a dopant material.
The composition of claim 1, wherein the doped core has an average size of about five microns to about 100 microns.
The composition of claim 1, wherein the coating has an average thickness of about 100 to 10,000 Angstroms.
The composition of claim 1, wherein the coating includes at least one material selected from the group consisting of:
The composition of claim 1, wherein the conductive particles consist essentially of a single material.
The composition of claim 1, wherein the conductive particles include an oxide coating.
The composition of claim 1, wherein the conductive particles include at least one material selected from the group consisting of:
The composition of claim 1, wherein the conductive particles have an average size of about five microns to about fifty microns.
The composition of claim 1, which is configured and arranged to be applied directly to a use without being encapsulated in a device.
The composition of claim 1, which is configured and arranged to be provided in a device.
The composition of claim 1, which includes at least one additional type of particle selected from the group consisting of:
A composition for protecting against electrical overstress comprising:
A particle for use in an electrical overstress composition comprising:
A particle for use in an electrical overstress composition comprising:
A method of making an electrical overstress composition comprising the steps of:
Dependencies are inferred from the claim text.