Solution jet type fabrication apparatus, method, solution containing fine particles, wiring pattern substrate, device substrate

A solution used for a solution jet type fabrication apparatus for fabricating a wiring pattern or a device, the solution jet type fabrication apparatus having a jet head for ejecting a droplet onto a substrate, so as to form a pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate, the substrate having no liquid absorbing property, the jet head including a nozzle from which the droplet is ejected, the nozzle having a size that is equal to or less than Φ20 μm, the solution comprising:

• fine particles where each of the fine particles has a size that is equal to or less than the roughness of a surface of the substrate, the fine particles satisfying a relation of 0.0001≦Dp/Do≦0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle, and the fine particles having a hardness less than that of a material of the nozzle.

A substrate used for a solution jet type fabrication apparatus for fabricating a wiring pattern or a device, the solution jet type fabrication apparatus having a jet head for ejecting a droplet of a solution containing fine particles onto a substrate, so as to form a pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate, the jet head including a nozzle from which the droplet is ejected, the nozzle being formed from a material that has a greater hardness than that of the fine particles in the solution, the nozzle having a size that is equal to or less than Φ20 μm, the nozzle satisfying a relation of 0.0001≦Dp/Do≦0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle, the substrate comprising:

• an electrode area on which the wiring pattern is formed,
• wherein the substrate has no liquid absorbing property,
• wherein the substrate has a surface having a roughness that is equal to or greater than the size of each of the fine particles.

A substrate used for a solution jet type fabrication apparatus for fabricating a wiring pattern or a device, the solution jet type fabrication apparatus having a jet head for ejecting a droplet of a solution containing fine particles onto a substrate, so as to form a pattern, by vaporizing a volatile ingredient of the solution, and allowing a solid component to remain on the substrate, the jet head including a nozzle from which the droplet is ejected, the nozzle being formed from a material that has a greater hardness than that of the fine particles in the solution, the nozzle having a size that is equal to or less than Φ20 μm, the nozzle satisfying a relation of 0.00011≦Dp/Do≦0.01, where Dp represents the diameter of each of the fine particles and Do represents the diameter of the nozzle, the substrate comprising:

• an electrode area on which the device is formed,
• wherein the substrate has no liquid absorbing property,
• wherein the substrate has a surface having a roughness that is equal to or greater than the size of each of the fine particles.