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US 2004/0201447 A1Published application
Thin-film resistor device
OwnerMarvin Glenn Wonginventor
Life of this patent
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Abstract
A thin-film resistor device is disclosed. In one embodiment, the device comprises a substrate supporting first and second contacts. A compliant material is deposited on the substrate. A thin-film resistor is deposited on the compliant material and coupled between the first and second contacts.
Claims16
A device comprising:
- a substrate;
- first and second contacts, supported by and in direct contact with the substrate;
- a compliant material deposited on the substrate;
- and
- a thin-film heater resistor coupled between the first and second contacts and deposited on the compliant material so that the thin-film heater resistor forms a weak bond with the compliant material and at least partially delaminates from the compliant material as the thin-film heater resistor heats.
2 more elements
3-4 (canceled)
9-23 (canceled)
A device comprising:
- a substrate;
- first and second contacts, supported by and in direct contact with the substrate;
- a corrugated compliant material deposited on the substrate;
- and
- a thin-film heater resistor coupled between the first and second contacts and deposited on the corrugated compliant material so that it contacts at least two ridges of the corrugated compliant material.
2 more elements
Dependencies are inferred from the claim text.