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AssigneeFurukawa Circuit Foil Co., Ltd.
InventorsAkira Matsuda, Yuuji Suzuki, Hideo Otsuka, Yuuki Kikuchi, Sadao Matsumoto
Estimating the term…
A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.
A conductive substrate with a resistance layer comprising a high conductivity substrate on the surface of which a roughening treating layer by resistance components is provided and over the roughening treating layer of which a resistance layer is provided.
A resistance board comprising:
A resistance circuit board comprising:
Dependencies are inferred from the claim text.