Conductive material for integrated circuit fabrication
AssigneeMicron Technology, Inc.
InventorYungjun Jeff Hu
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Abstract
A conductive composition of titanium boronitride (TiBxNy) is disclosed for use as a conductive material. The titanium boronitride is used as conductive material in the testing and fabrication of integrated circuits. For example, the titanium boronitride is used to construct contact pads such as inline pads, backend pads, sensors, or probes. Advantages of embodiments of the titanium boronitride include reduced scratching, increased hardness, finer granularity, thermal stability, good adhesion, and low bulk resistivity. Exemplary methods of creating the titanium boronitride include a sputtering process and a plasma anneal process.
Claims44
An integrated circuit comprising a pad with a TiBxNy conductor wherein the TiBxNy conductor conducts electrical signals between the integrated circuit and test circuitry.
An integrated circuit comprising a TiBxNy conductor wherein the TiBxNy conductor conducts electrical signals between the integrated circuit and test circuitry.
Dependencies are inferred from the claim text.