Metal seal packaging for organic light emitting diode device

A large area metal sealed flat organic light emitting diode device comprising:

• a flat top glass lid member having two surfaces of which inner surface has plurality of N centrally recessed portions, the said plurality of N recessed portions providing a reservoir space for getter and dessicant, the said dessicant and getter laid flat on each of the said N recessed portions to be in strong bond with the surface of the said N recessed portions, a band of metal stack laid flat at the perimeter of the inner surface of said glass lid member bordering each of N recessed portions so as to be in strong bond with the said surface of the glass lid member, a low temperature melting solder metal alloy laid flat on the said metal stack and pre-tinned to be in strong bond with the said metal stack;
• a bottom glass substrate member having two surfaces of which the inner surface, centrally containing a transparent anode and an active organic light emitting diode device, faces the inner surface of the said glass lid member, the inner surface of the said glass substrate member further containing a band of dielectric layer laid at the perimeter of the inner surface of the said glass substrate member to be in strong bond with the transparent anode and inner surface of the said glass substrate member, a band of metal stack laid over the said dielectric layer forming a strong bond with the dielectric layer;
• said glass lid member and plurality of N said glass substrate members placed in contact with their inner surfaces facing each other inside a Nitrogen controlled environment;
• said band of metal stack of each of the said plurality of N glass substrate members and each pre-tinned band of said solder alloy bordering each of the plurality of N recessed portions of said glass lid member, contacting their surfaces in substantial alignment;
• said glass lid member and each of the plurality of N glass substrate members thermally sealed in substantial alignment through the said solder alloy, enclosing pure Nitrogen.