Conductive contamination reliability solution for assembling substrates

11:

• The method of claim 9, wherein said substrate is a printed circuit board (PCB).

12:

• The method of claim 11, wherein said plurality of conductive contacts of said PCB comprise a plurality of through-holes.

13:

• The method of claim 9, further comprising:
• attaching a heat dissipation device to said electrical component before pushing said plurality of leads of said electrical component on said plurality of conductive contacts on said substrate.

14:

• The method of claim 13, further comprising:
• bonding one or more tabs on said heat dissipation device to said substrate.

15:

• The method of claim 9, wherein said electrical component is a power semiconductor.

16:

• The method of claim 9, wherein said bonding of said plurality of leads of said electrical component to said plurality of conductive contacts includes re-flowing a solder compound to electrically connect said plurality of leads of said electrical component to said plurality of conductive contacts.

18:

• The assembled substrate of claim 17, wherein said substrate is a printed circuit board (PCB).

19:

• The assembled substrate of claim 18, wherein said plurality of conductive contacts of said PCB comprise a plurality of through-holes.

20:

• The assembled substrate of claim 17, further comprising:
• a heat dissipation device attached to said electrical component.

21:

• The assembled substrate of claim 20, further comprising:
• a heat dissipation device having one or more tabs to bond said heat dissipation device to said substrate.

22:

• The assembled substrate of claim 17, wherein said electrical component is a power semiconductor.

23:

• The assembled substrate of claim 17, wherein said elastomer has a plurality of grooves and said plurality of leads are pushed into said plurality of grooves to substantially encapsulate said plurality of leads of said electrical component.

24:

• The assembled substrate of claim 17, wherein said bond between a corresponding lead of said plurality of leads of said electrical component to a corresponding conductive contact of said plurality of conductive contacts includes a solder compound to electrically connect said corresponding lead to said corresponding conductive contact.

25:

• An electrical component assembled onto a substrate in accordance with the method of claim 9.

27:

• An electrical component assembled onto a substrate in accordance with the method of claim 26.

28:

• The method of claim 26, wherein said substrate is a printed circuit board (PCB).

29:

• The method of claim 26, further comprising:
• attaching a heat dissipation device to the electrical component prior to placing the electrical component on the substrate.

30:

• The method of claim 26 further comprising:
• bonding one or more tabs on the heat dissipation device to the substrate.

31:

• The method of claim 26, wherein said electrical component is a power semiconductor.

32:

• The method of claim 26, wherein the plurality of leads are pushed into the plurality of grooves to substantially encapsulate the plurality of leads before pushing the plurality of leads on the plurality of conductive contacts on the substrate.

33:

• The method of claim 26, wherein the bonding of the plurality of leads of the electrical component to the plurality of conductive contacts includes re-flowing a solder compound to electrically connect the plurality of leads of the electrical component to the plurality of conductive contacts.

34:

• The method of claim 26, wherein the grooves are designed to close at a top after the electrical component is placed into the compliant elastomer and after the electrical component and compliant elastomer are both placed on the substrate.